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F
Very interesting.
Apr 7, 2026
U
Very interesting.
Apr 7, 2026
U
It's intrinsic to EUV process:
Apr 7, 2026
S
So did Intel? Intel also began to work on Co Packaged optics and bunch of others before TSMC its just a Intel habit of being too early...
Apr 7, 2026
S
1000% agree - when I read Intel doing this originally, it changed my mind from "they are hurting" to "they are going to be insolvent...
Apr 7, 2026
F
They are different.
Rapidus is funded by the Japanese government (through grants and share purchases) and by many Japanese companies...
Apr 7, 2026
M
Mr. Chandrasekaran probably doesn’t know that TSMC began working on advanced packaging as far back as 2009.
The following text is part...
Apr 6, 2026
Intel's process variability is at least partially a result of their historical needs. As a CPU manufacturer they have always been able...
Apr 6, 2026
Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was...
Apr 6, 2026
Mr. Chandrasekaran probably doesn’t know that TSMC began working on advanced packaging as far back as 2009.
The following text is part...
Apr 6, 2026
B
Sanders is an idiot.
Apr 6, 2026
A
Sanders is an idiot.
Apr 6, 2026
F
Not many HBM teardowns available but I had taken recent die area efficiency for the array ~50%, with TSVs ~10% (a strip down the...
Apr 6, 2026
F
Look at the die size for HBM vs DDR chips. The die size penalty is not small. Its not 3x either.
Apr 6, 2026
F
The Apple Neo macbook just show that TSMC do also experience Yield issues in TSMC. As this can meant that there is so many unusable...
Apr 6, 2026