Bronco Webinar 800x100 1

Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC

Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
by Daniel Nenni on 05-20-2026 at 10:00 am

SIemens EDA TSMC Teshnical Symposium 2026

At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More


Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips

Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
by Daniel Nenni on 05-20-2026 at 8:00 am

Semidynamics Secures a Strategic Investment

In the rapidly evolving world of artificial intelligence hardware, memory bandwidth and data movement have become just as important as raw compute power. Addressing this challenge head-on, Semidynamics has announced a strategic investment aimed at accelerating the development of its next-generation memory-centric AI … Read More


Quantum Gathering Momentum Amid Concerns for the Grid

Quantum Gathering Momentum Amid Concerns for the Grid
by Bernard Murphy on 05-20-2026 at 6:00 am

Quantum attack on the power grid

I posted recently on an eye-catching advance in quantum computing, around neutral atom systems which might accelerate the transition to production-grade fault-tolerant quantum computing (QC). There are some further updates on this front, also I listened in on a panel considering quantum-based hacking vulnerability in the… Read More


PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026

PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026
by Daniel Nenni on 05-19-2026 at 10:00 am

PQSNews Ultra small Embedded World

As the threat of quantum computing to modern cybersecurity becomes increasingly real, the technology industry is accelerating efforts to develop cryptographic systems capable of resisting quantum attacks. One of the most significant developments in this field was presented at Embedded World 2026 in Nuremberg, Germany, … Read More


Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)

Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)
by Moh Kolb on 05-19-2026 at 8:00 am

PictureGFL

The semiconductor industry has achieved extraordinary mastery in silicon signoff. Modern EDA environments can now optimize timing closure, physical verification, IR/EM behavior, routing density, thermal interaction, and increasingly even design-space exploration through AI-assisted implementation flows. Crossing… Read More


imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling

imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
by Daniel Nenni on 05-19-2026 at 6:00 am

TSMC 3DFabric Alliance Expansion Signals New Era of System Level Scaling

imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More


Crossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting

Crossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting
by Admin on 05-18-2026 at 10:00 am

Crossing the Yield Cliff IDP V6 and the Future of Manufacturing Forecasting

The paper, Industrial Defectivity Prediction (IDP) V6: A Two-Layer Yield Cliff Framework for Cross-Industry Mass-Production Forecasting, presents a generalized industrial yield-modeling architecture that extends the classical Negative Binomial framework through a two-layer phenomenological structure designed … Read More


From the Selfie to Samantha: The Next Trillion-Dollar Behavior

From the Selfie to Samantha: The Next Trillion-Dollar Behavior
by Jonah McLeod on 05-18-2026 at 8:00 am

Yuning Jonah

At CES 2026, Samsung called it a “companion.” Lenovo called it “ambient intelligence.” OpenAI spent $6.4 billion on a screenless device designed to be a continuous presence in your pocket. Meta acquired Limitless, the AI pendant that had been tracking everything its wearers said and heard. Every major consumer electronics company… Read More


AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC

AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC
by Daniel Nenni on 05-18-2026 at 6:00 am

AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC

Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More


CEO Interview with RP Singh of Seasia Infotech

CEO Interview with RP Singh of Seasia Infotech
by Daniel Nenni on 05-17-2026 at 2:00 pm

RP Singh Photo (1)

Rupinder Pal Singh is the co-founder and CEO of Seasia Infotech, a role he takes great pride in. Sharing insights into the business and industry is something he always looks forward to. As the leader of the Seasia Group of Companies, Singh is tasked with overseeing all aspects of operations, ensuring that the company delivers… Read More