Accellera Strengthens Industry Collaboration and Standards Leadership at DVCon U.S. 2026At DVCon U.S. 2026, Accellera Systems Initiative reinforces…Read More
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Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026The semiconductor industry’s transition toward chiplet-based architectures is…Read More
As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30–50% of engineers’ effort in debugging and reanalyzing circuits. Addressing these multiphysics effects requires early verification strategies and reliable simulation solutions. Modern … Read More
The Field-Effect Transistor (FET), a cornerstone of modern electronics, marks its centennial in 2025, tracing back to Julius Edgar Lilienfeld’s groundbreaking invention in 1925. Born in 1882 in what is now Lviv, Ukraine, Lilienfeld was a prolific physicist who earned his PhD from Berlin University in 1905. His early … Read More
Up to now the RISC-V community has been developing open-source processor implementations to a stage where they can appeal to system designers looking for alternatives to proprietary Arm and x86 cores. Toward this end, two projects have emerged as particularly significant examples of where RISC-V is heading. One is Ara, a vector… Read More
As I’ve discussed before, Samtec has a way of dominating every trade show the company participates in. The upcoming DesignCon event is no exception. At the show, Samtec will be discussing data rates up to 448 Gbps and signals up to 130 GHz. Beyond a rich set of demonstrations in the company’s booth, Samtec engineers will be participating… Read More
I wrote last year about a company called Bronco, offering an agentic approach to one of the hottest areas in verification – root-cause debug. I find Bronco especially interesting because their approach to agentic is different than most. Still based on LLMs of course but emphasizing playbooks of DV wisdom for knowledge capture … Read More
TSMC continues to reinforce its leadership in advanced semiconductor manufacturing through its deepening collaboration with Cadence Design Systems. The expanded partnership focuses on enabling next-generation artificial intelligence and high-performance computing innovations by aligning advanced electronic design… Read More
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Daniel is joined by Dr. Christophe Maleville, Chief Technology Officer and Senior Executive Vice-President of Soitec’s Innovation. He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer… Read More
The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More
The rapid evolution of semiconductor design has elevated chiplets from a niche concept to a foundational strategy for next-generation computing. At the upcoming Chiplet Summit – February 17–19, 2026 Santa Clara Convention Center. Silicon Catalyst will play a central role in shaping this conversation, highlighting… Read More
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