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    by Published on 02-25-2017 06:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. Semiconductor Events,
    4. eSilicon,
    5. Samsung Foundry,
    6. FinFET
    Article: ARM and a LEG-semiwiki-esilicon-rambus-new-samsung-foundry-seminar-400px-20170216-jpg

    Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which are tracked quite closely on SemiWiki.com. It was a very informative session with great food ...
    by Published on 02-24-2017 11:00 AM
    1. Categories:
    2. Cadence
    Article: IBM Tapes Out 14nm ARM Processor on Cadence Flow-powertree_setup-jpg

    The difficulty of managing the power domains on a complex SoC led to the development of a power format file description, to serve as the repository for data needed for functional and electrical analysis (e.g., CPF, UPF). Yet, what about complex printed circuit boards? How can the power domain information ...
    by Published on 02-24-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Mentor Graphics
    Article: IBM Tapes Out 14nm ARM Processor on Cadence Flow-hubble-space-telescopes-25th-anniversary-picture-jpg

    Since the beginning of time, people on Earth have peered into the night sky, pondering if they were alone in the universe. Today, we have a large group of scientists that are working to answer that question. The precision required for their search often depends on the performance of a key piece of technology – the analog-to-digital converter (ADC).
    ...
    by Published on 02-23-2017 11:10 AM
    1. Categories:
    2. Cadence,
    3. IoT Internet of Things,
    4. Automotive
    Article: SpyGlass IP Kit 2.0-fusion-dsp-7-boxes-png

    If we agree on the definition of IoT as a distributed set of services based on sensing, sharing and controlling through new nodes, we realize that these nodes are a big hardware opportunity. The chip makers and IP vendors have to create innovative SoC, delivering high performance at low cost and low energy. Moreover, the new systems will have to integrate multiple sensors and stay in Always Alert mode.

    ...
    by Published on 02-23-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Semiconductor Events,
    4. Silvaco
    Article: ARM and a LEG-silvaco-tools-min-jpg

    Out of college my first job was doing circuit design at the transistor-level with Intel, and to get accurate SPICE netlists for simulation we had to manually count the squares of parasitic interconnect for diffusion, poly-silicon and metal layers. Talk about a burden and chance for ...
    by Published on 02-22-2017 11:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. FPGA,
    4. Flex Logix
    Article: John Cooley (DeepChip.com) Reads SemiWiki!-t40ulp-power-management-jpg

    Last month, I made a "no-brainer" forecast that 2017 would be the year in which embedded FPGA (eFPGA) IP would emerge as a key differentiator for new SoC designs (link to the earlier article here).

    The fusion of several technical and market factors are motivating design teams to incorporate programmable logic functionality into their feature set: ...
    by Published on 02-22-2017 06:00 AM
    1. Categories:
    2. IoT Internet of Things
    Article: IBM Tapes Out 14nm ARM Processor on Cadence Flow-coin-cell-battery-min-jpeg

    We’ve become pretty good at reducing power in IoT edge devices, to the point that some are expected to run for up to 10 years on a single battery charge. But what if you wanted to go lower still or ...
    by Published on 02-21-2017 11:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Mentor Graphics,
    4. Semiconductor Events
    Have you used the modern DxDesigner?  Gary Lameris describes enhancements in his blog-eric_b-jpg

    The engineering team for the design and analysis of a complex system consists of a diverse set of skills -- with the increasing emphasis on both high-speed interface design and multi-domain power management, a critical constituent of the team is the group of signal integrity (SI) and power integrity (PI) engineers.

    The training of SI/PI engineers requires ...
    by Published on 02-21-2017 06:00 AM
    1. Categories:
    2. Silicon Photonics
    Article: Beneath the Surface lies the first real test-plasmofab-jpg

    In the last year we have seen a marked increase in activity around the integrated photonics space, especially around silicon-based photonics. Last year the American Institute for Manufacturing of Photonics (better known as AIM Photonics) was started to boot-strap U.S. ...
    by Published on 02-20-2017 11:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Mentor Graphics,
    4. Semiconductor Events
    Article: Beneath the Surface lies the first real test-2017_dvconus_logo_web-sm-min-png

    You’d expect Mentor to be covering a lot of bases at DVCon and you wouldn’t be wrong. They’re hosting tutorials, a lunch, papers, posters, there's a panel and of course they’ll be on the exhibit floor. I’ll start with an important tutorial that you really should attend, ...

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