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Semiconductor Expert Forum

Podcast EP339: Unique Scalable, Power-Efficient AI Technology from EdgeCoritx with Dr. Sakya Dasgupta

Podcast EP339: Unique Scalable, Power-Efficient AI Technology from EdgeCoritx with Dr. Sakya Dasgupta
by Daniel Nenni on 04-10-2026 at 10:00 am
Categories: AI

Daniel is joined by Dr. Sakya Dasgupta, CEO and founder of EdgeCortix. He is a seasoned technologist who has been at the forefront of artificial intelligence systems for the past two decades. His experience spans public research institutes such as The Max Planck Society and RIKEN, as well as leading corporations like Microsoft… Read More

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CEO Interview with Steve Kim of Chips&Media

CEO Interview with Steve Kim of Chips&Media
by Daniel Nenni on 04-10-2026 at 6:00 am
Categories: Automotive, CEO Interviews, Chips&Media, IP

C&M CEO Steve 2

I’m Steve Kim, the CEO of Chips&Media. I’ve been immersed in the multimedia imaging industry for approximately two decades. Prior to joining Chips&Media, I spent over five years working within handset manufacturing companies. Following more than ten years here at Chips&Media in roles spanning Marketing, Sales,… Read More

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yieldHUB Expands Its Impact with New Technology and a New Website

yieldHUB Expands Its Impact with New Technology and a New Website
by Mike Gianfagna on 04-09-2026 at 10:00 am
Categories: Analytics, EDA, yieldHUB

yieldHUB Expands Its Impact with New Technology and a New Website

yieldHUB is a unique company that focuses on yield optimization for the semiconductor industry. The company aims to bring engineering teams together with a platform that allows sharing of data analytics and knowledge about products to improve yield. This goal is certainly fueled by unifying data from multiple steps in the manufacturing… Read More

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NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures

NXP Expands Arteris NoC Deployment to Scale Edge AI Architectures
by Daniel Nenni on 04-09-2026 at 8:00 am
Categories: Arteris, IP

NXP announcement v4b 021026 FINAL

As edge AI systems become more centralized and compute-dense, on-chip data movement is increasingly the architectural bottleneck. NXP’s expanded deployment of Arteris network-on-chip (NoC) and cache-coherent interconnect IP highlights a broader industry trend: interconnect architecture is now a first-order design … Read More

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Architecting Intelligence: The Rise of RISC-V CPUs in Agentic AI Infrastructure

Architecting Intelligence: The Rise of RISC-V CPUs in Agentic AI Infrastructure
by Daniel Nenni on 04-09-2026 at 6:00 am
Categories: AI, IP, RISC-V, SiFive

The rise of RISC V CPUs SiFive

SiFive’s newly announced $400 million Series G financing represents a significant technical inflection point for high-performance RISC-V CPU development targeted at agentic AI data center workloads. The funding, which values the company at $3.65 billion, is specifically intended to accelerate next-generation CPU IP, … Read More

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Intel, Musk, and the Tweet That Launched a 1000 Ships on a Becalmed Sea

Intel, Musk, and the Tweet That Launched a 1000 Ships on a Becalmed Sea
by Jonah McLeod on 04-08-2026 at 12:00 pm
Categories: Foundries, Intel Foundry

Intel Terafab SemiWiki

Intel, Musk, and the Tweet That Launched a 1000 Ships on a Becalmed Sea
Why do professional executives running major corporations frame a major moment in their company’s history with a tweet? Jerry Sanders, who passed away just last December, spent his career yelling “real men have fabs!” Now Intel has fabs–and… Read More

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From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration

From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration
by Daniel Nenni on 04-08-2026 at 10:00 am
Categories: EDA, Synopsys

Types of Mutli Deisgn Packaging Synsopsys

Modern automotive electronics are undergoing a rapid transformation driven by increasing compute demands, functional safety requirements, and the shift toward scalable semiconductor architectures. One of the most significant technological developments enabling this transformation is the adoption of multi-die system… Read More

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Agentic AI Demands More Than GPUs

Agentic AI Demands More Than GPUs
by Daniel Nenni on 04-08-2026 at 8:00 am
Categories: AI, Foundries, Intel Foundry

Agentic AI Requires More CPUs

Agentic AI workloads are reshaping the compute requirements of modern data center infrastructure by shifting performance bottlenecks from GPU-centric inference to CPU-heavy orchestration and workflow management. Traditional AI inference pipelines relied primarily on GPUs performing a single forward pass, where input… Read More

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Accellera Updates at DVCon 2026

Accellera Updates at DVCon 2026
by Bernard Murphy on 04-08-2026 at 6:00 am
Categories: Accellera, AI, Semiconductor Services

logo accellera

Lu Dai (chair of Accellera) and I had our regular chat at DVCon U.S. 2026. Accellera also hosted a reception in the exhibits hall, with free snacks and drinks, very well attended. We talked about what’s new in Accellera, with a particular emphasis on the recently released standard for CDC and RDC tool interoperability, also Lu’s … Read More

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When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives

When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives
by Admin on 04-07-2026 at 10:00 am
Categories: Andes Technology, Events, IP, RISC-V

SemiWiki

Marc Evans, Director of Business Development & Marketing, Andes Technology USA

I work at a RISC-V IP company, and I genuinely root for Arm — probably more than most people in my position would admit. Not because I’m confused about who competes with whom, but because Arm’s best move for their shareholders is also… Read More