As I’ve discussed before, Samtec has a way of dominating every trade show the company participates in. The upcoming DesignCon event is no exception. At the show, Samtec will be discussing data rates up to 448 Gbps and signals up to 130 GHz. Beyond a rich set of demonstrations in the company’s booth, Samtec engineers will be participating… Read More
Why PDF Solutions Is Positioning Itself at the Center of the Semiconductor EcosystemThe semiconductor industry is on track to exceed…Read More
Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026The semiconductor industry’s transition toward chiplet-based architectures is…Read More
CEO Interview with Dr. Raj Gautam Dutta of Silicon AssuranceDr. Raj Gautam Dutta is the Co-Founder and…Read MoreBronco Debug Stress Tested Measures Up
I wrote last year about a company called Bronco, offering an agentic approach to one of the hottest areas in verification – root-cause debug. I find Bronco especially interesting because their approach to agentic is different than most. Still based on LLMs of course but emphasizing playbooks of DV wisdom for knowledge capture … Read More
TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon
TSMC continues to reinforce its leadership in advanced semiconductor manufacturing through its deepening collaboration with Cadence Design Systems. The expanded partnership focuses on enabling next-generation artificial intelligence and high-performance computing innovations by aligning advanced electronic design… Read More
CEO Interview with Elad Raz of NextSilicon
Elad Raz is the founder and CEO of NextSilicon, which he established in 2018 to fundamentally rethink how HPC architectures are built. After more than two decades designing and scaling advanced software and compute systems, Elad saw firsthand the limits of fixed, inflexible processor designs. He founded NextSilicon to address… Read More
Podcast EP331: Soitec’s Broad Impact on Quantum Computing and More with Dr. Christophe Maleville
Daniel is joined by Dr. Christophe Maleville, Chief Technology Officer and Senior Executive Vice-President of Soitec’s Innovation. He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer… Read More
TSMC vs Intel Foundry vs Samsung Foundry 2026
The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More
Silicon Catalyst at the Chiplet Summit: Advancing the Chiplet Economy
The rapid evolution of semiconductor design has elevated chiplets from a niche concept to a foundational strategy for next-generation computing. At the upcoming Chiplet Summit – February 17–19, 2026 Santa Clara Convention Center. Silicon Catalyst will play a central role in shaping this conversation, highlighting… Read More
Giving AI Agents Access to a Compiled Design and Verification Database
A few weeks ago, I had the chance to work with AMIQ EDA as they introduced a new product: DVT MCP Server. I was quite intrigued by the role it will play in AI-assisted chip design and verification, so I wanted to learn more. I spoke with Gabriel Busuioc, the AI Assistant team leader at AMIQ EDA, to understand more about the product and how… Read More
How Memory Technology Is Powering the Next Era of Compute
For more than a decade, progress in artificial intelligence has been framed almost entirely through the lens of compute. Faster GPUs, denser accelerators, and higher TOPS defined each new generation. But as generative and agentic AI enter their next phase, that framing is no longer sufficient. The most advanced AI systems today… Read More
Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems
Semidynamics has taken a significant step forward in the race to build next-generation AI infrastructure with the unveiling of its 3nm AI inference silicon and a vertically integrated, full-stack systems strategy. Announced in February 2026, the development marks the company’s evolution from an advanced architecture specialist… Read More



TSMC vs Intel Foundry vs Samsung Foundry 2026