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IP update from Alphacore at DAC 2026

IP update from Alphacore at DAC 2026
by Daniel Payne on 11-03-2026 at 10:00 am

alphacore at dac 2026

Rusafa Shahreen, Director of Technical Marketing at Alphacore met with me at DAC 2026 to provide an update on what’s new in their IP for AMS, RF, imaging and rad-hard designs. Her background includes MSEE and MBA degrees, plus seven years at Alphacore in Arizona. The founders of the company have a rad-hard background and their early… Read More


Ceva’s next NeuPro generation opens new possibilities across AI

Ceva’s next NeuPro generation opens new possibilities across AI
by Daniel Nenni on 11-03-2026 at 8:00 am

CEVA NEUPRO NPU portfolio

Ceva is broadening the possibilities for AI silicon with a new generation of its NeuPro neural processing unit portfolio, bringing a common architecture and unified software environment to applications spanning sensors, intelligent devices and cloud infrastructure.

Announced on October 28, the portfolio reflects an opportunity:… Read More


How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB Live

How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB Live
by Daniel Nenni on 11-03-2026 at 6:00 am

How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB Live

Allegro MicroSystems’ experience with yieldHUB Live shows how better use of production data can translate into measurable manufacturing gains. At its high-volume semiconductor operation in the Philippines, Allegro set out to improve overall equipment effectiveness, or OEE, by one percentage point. According to the customer… Read More


Interview with Sweta Gupta, VP of Engineering of Analog Bits

Interview with Sweta Gupta, VP of Engineering of Analog Bits
by Daniel Nenni on 11-02-2026 at 12:00 pm

Sweta Gupta in analog innovation

Sweta Gupta is the Vice President of Engineering at Analog Bits, where she leads development and execution of mixed-signal IP’s, managing circuit and layout teams.

Ms. Gupta has been a part of the Analog Bits team since 2004 and she has successfully managed and delivered high quality IP’s including low jitter PLL’s, low power crystal… Read More


WEBINAR: Porting, Analysing & Optimising AI Models onto Edge GPUs

WEBINAR: Porting, Analysing & Optimising AI Models onto Edge GPUs
by Daniel Nenni on 11-02-2026 at 10:00 am

Edge GPU AI webinar banner

Modern AI models are opening up new possibilities at the edge. Turning those possibilities into responsive, efficient applications, however, requires more than choosing hardware with an impressive TOPS figure. Developers need to understand how models behave on their target devices, where performance is lost, and which optimisations… Read More


Using AI for Root Cause Analysis of Simulation Failures

Using AI for Root Cause Analysis of Simulation Failures
by Tom Anderson on 11-02-2026 at 8:00 am

RCA Demo

I’ve been working with AMIQ EDA for almost nine years now, writing about their cool technologies and interviewing users about their experiences. I’ve read through more user guides and release notes than I can count. I’ve watched many dozens of video clips showing how to use their products. I’ve even visited their headquarters … Read More


Agentic AI accelerates 3D IC engineering for the AI factory era

Agentic AI accelerates 3D IC engineering for the AI factory era
by Admin on 11-02-2026 at 6:00 am

Agentic AI Reimagines 3D IC Engineering

By Sudarshan Deo, software R&D Manager for 3D IC, Siemens

What if you could completely rethink what an EDA workflow looks like for the increasingly complex 3D ICs powering the next generation of AI factories? Siemens’ expanded agentic AI portfolio is automating the hardest parts of 3D IC engineering.

At NVIDIA GTC Berlin 2026,… Read More


Intel’s Tiny Bridges Could Lead to Very Big Paychecks

Intel’s Tiny Bridges Could Lead to Very Big Paychecks
by Daniel Nenni on 11-01-2026 at 12:00 pm

Tiny Chip Builders, Big Payday

Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models. Yet it increasingly determines how effectively those technologies perform.… Read More


CEO Interview with Vera Yang of Flexcompute

CEO Interview with Vera Yang of Flexcompute
by Daniel Nenni on 11-01-2026 at 11:00 am

Vera Yang Grounding AI in Physics

Vera Yang is President and Co-Founder of Flexcompute, a frontier AI lab building a Physics World Model that bridges data-driven AI and the laws of physics. She focuses on the problems where the stakes are highest and the physics hardest, including photonic chips for AI data centers, advanced semiconductor packaging and spacecraft… Read More


High-NA’s Obituary Was Premature

High-NA’s Obituary Was Premature
by Daniel Nenni on 11-01-2026 at 10:00 am

High NA’s premature obituary

High numerical aperture EUV lithography was supposed to be the next step in semiconductor manufacturing. Then came the doubts: expensive scanners, smaller exposure fields, difficult economics and big customers finding ways to stretch existing equipment. It became tempting to confuse a delayed adoption curve with a technology… Read More