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Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems

Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems
by Kalar Rajendiran on 03-03-2026 at 10:00 am

UCIe bump planning in 3DIC Compiler Platform

The first article in this series examined how feasibility exploration (hyperlink to SemiWiki first article) enables architects to evaluate multi-die system configurations while minimizing early design risk. Once architectural decisions are validated, designers must translate conceptual connectivity requirements … Read More


CHERI: Hardware-Enforced Capability Architecture for Systematic Memory Safety

CHERI: Hardware-Enforced Capability Architecture for Systematic Memory Safety
by Daniel Nenni on 03-03-2026 at 8:00 am

CHERI Technology Overview 2026

The rapid escalation of cyberattacks over the past two decades has exposed a fundamental weakness at the core of modern computing systems: the lack of memory safety. Industry data consistently shows that the majority of critical software vulnerabilities stem from memory corruption issues such as buffer overflows, use-after-free… Read More


WEBINAR: Two-Part Series on RF Power Amplifier Design

WEBINAR: Two-Part Series on RF Power Amplifier Design
by Don Dingee on 03-03-2026 at 6:00 am

VNA inspired simulated load pull setup for RF power amplifier design

At lower frequencies with simpler modulation, RF power amplifier (PA) designers could safely concentrate on a few primary metrics – like gain and bandwidth – and rely on relaxed margins to ensure proper operation in a range of conditions. Today’s advanced RF PA design is a different story. mmWave and sub-THz frequencies introduce… Read More


Securing RISC-V Third-Party IP: Enabling Comprehensive CWE-Based Assurance Across the Design Supply Chain

Securing RISC-V Third-Party IP: Enabling Comprehensive CWE-Based Assurance Across the Design Supply Chain
by Admin on 03-02-2026 at 10:00 am

RISC V 3PIP CWE Workflow BR 022626

by Jagadish Nayak

RISC-V adoption continues to accelerate across commercial and government microelectronics programs. Whether open-source or commercially licensed, most RISC-V processor cores are integrated as third-party IP (3PIP), potentially introducing supply chain security challenges that demand structured,… Read More


Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates

Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
by Daniel Nenni on 03-02-2026 at 8:00 am

Qualcomm’s QTM565 mmWave Antenna Module

Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17 lineup relies on advanced SOITEC based Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology. The discovery highlights a significant architectural shift in high-frequency… Read More


Another Quantum Topic: Quantum Communication

Another Quantum Topic: Quantum Communication
by Bernard Murphy on 03-02-2026 at 6:00 am

Quantum teleportation

In my recent series on quantum computing (QC), I intentionally overlooked a couple of adjacent topics: quantum communication and quantum sensing. These face some of the same challenges as QC, however I noticed a recent report on a test quantum network implemented by Cisco and Qunnect which led me to find more from Cisco on their … Read More


Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability

Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability
by Daniel Nenni on 03-01-2026 at 6:00 pm

World First 8nm 128Mb Embedded STT MRAM for Automotive

The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More


CEO Interview with Echo Yang of CSCERAMIC

CEO Interview with Echo Yang of CSCERAMIC
by Daniel Nenni on 03-01-2026 at 4:00 pm

Echo yang


Echo Yang is the CEO of CSCERAMIC, a China-based manufacturer specializing in advanced ceramic materials and precision ceramic components for industrial and laboratory applications. With a background spanning international trade, manufacturing coordination, and engineering-driven supply chain development, Echo leads… Read More


Podcast EP333: A Look at the Broad, Worldwide Impact SEMI Has on the Semiconductor Industry with Ajit Manocha

Podcast EP333: A Look at the Broad, Worldwide Impact SEMI Has on the Semiconductor Industry with Ajit Manocha
by Daniel Nenni on 02-27-2026 at 10:00 am

Daniel is joined by Ajit Manocha, president and CEO of SEMI, the global industry association serving the semiconductor and electronics manufacturing and design supply chain. Throughout his career, Manocha has been a champion of industry collaboration as a critical means of advancing technology for societal and economic prosperity.… Read More


Memory Matters: Signals from the 2025 NVM Survey

Memory Matters: Signals from the 2025 NVM Survey
by Daniel Nenni on 02-27-2026 at 6:00 am

when do you expect to choose

Non-volatile memory choices are becoming more complex as SoC designs push into advanced nodes, and new requirements driven by AI, new sensor technologies and stringent quality standards.

The second annual 2025 NVM Survey, completed in December, captures a market that still hangs on established technologies but is increasingly… Read More