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I
I know, as I said this is *not* the average power across the chip which is much lower, but the maximum power density in the hottest bits...
Feb 20, 2026
I
I'm not convinced that TSMC A16 will be any later than Intel 14A in reality as opposed to on Powerpoint presentations, especially given...
Feb 20, 2026
A
The the converse should apply to TSMC BSPD. They are a year behind Intel at 18A and will be a year behind 14A unless I misread the...
Feb 19, 2026
B
The original unveil of 14A was February 2024, and the text at bottom seems to indicate 2027 was the initial expectation.
Feb 19, 2026
B
I believe Pat Gelsinger originally said 14A would be in risk production in 2026, then I heard 2027, now Lip-Bu says 2028. The 14A .5 PDK...
Feb 19, 2026
D
BSPD is an HPC technology for all the reasons Ian pointed out above and also because it costs more and requires new design techniques...
Feb 19, 2026
February 19, 2026
Plano, Texas, USA
Siemens’ Innovator3D IC software recognized for advancing 2.5D and 3D chiplet integration...
Feb 19, 2026
February 17, 2026
Raleigh, NC, USA
North Carolina selected as the first state to implement the robust and scalable training model...
Feb 19, 2026
February 16, 2026
Plano, Texas, USA
HD Hyundai Heavy Industries’ Ulsan Shipyard (Image courtesy of HD Hyundai)
- Siemens to provide...
Feb 19, 2026
Siemens EDA, UCIe Consortium, and Sarcina Technology Win the First Annual Chiplet Industry Awards Celebrating Technical Innovation and...
Feb 19, 2026
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory...
Feb 19, 2026
Next-generation architecture delivers faster analysis, clearer insights, and a compact design to turn days of digital validation into...
Feb 19, 2026
New validation solutions enable data center operators to overcome bandwidth, latency, and interoperability challenges as AI...
Feb 19, 2026
ISSCC Paper Presents New 22 nm IC That Delivers Record Scan Speed, Wide Spectral Coverage, and High Sensitivity—Moving Electron...
Feb 19, 2026
Detail view of the system-on-interposer, with a companion electro-optical router for each computing die and two additional routers for...
Feb 19, 2026
Like.
The original unveil of 14A was February 2024, and the text at bottom seems to indicate 2027 was the initial expectation.
AmandaK posted the thread Siemens wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit in Siemens EDA.February 19, 2026 Plano, Texas, USA Siemens’ Innovator3D IC software recognized for advancing 2.5D and 3D chiplet integration...
