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The issue is how cool you have to keep the lower face of the heatsink/package lid that contacts the top of the die, and how much hotter...
Feb 6, 2026
S
Intel product carried by Intel Fabs? Look at Intel Products going external and messing it up you seem to have forgotten the edge Fabs...
Feb 6, 2026
S
Sorry to disappoint you, but there are no usable dielectric materials which are low thermal resistance and low-k which can be used for...
Feb 6, 2026
B
Probably controversial for this forum, but I think Pat tried to break that cycle by building as much leading edge fab capacity as...
Feb 6, 2026
I
So lets poke at that a Little:
If you do Fab in the US. you need to ship most units (at least some) outside the US
What if other...
Feb 6, 2026
I
Perhaps.... I downplay this because I keep talking to Taiwanese friends who are not worried for whatever reason ... and because if there...
Feb 6, 2026
I
https://www.cna.com.tw/news/afe/202602050149.aspx
....................................................................
Experts predict...
Feb 6, 2026
I
Around the world, anything related to national security and sovereignty is not limited to cost considerations alone. Trump’s political...
Feb 6, 2026
I
Why pursue the NOT TSMC market? If I was a semiconductor CEO I would be concerned with:
Wafer Pricing. The foundry business thrived on...
Feb 6, 2026
I
Dan puts this well. No one is really saying "I will look at TSMC and Rapidus in parallel to see who wins". If you are "not TSMC"...
Feb 6, 2026
Y
Hahaha.. looks like Microsoft Age Of Empires needs an new Civilization level...
Feb 6, 2026
Interesting story, partially open in the newsletter of SemiAnalysis about Claude Code:
Feb 05, 2026
Doug O'Laughlin, Jeremie Eliahou...
Feb 6, 2026
I
Sorry to disappoint you, but there are no usable dielectric materials which are low thermal resistance and low-k which can be used for...
Feb 6, 2026
I
The issue is how cool you have to keep the lower face of the heatsink/package lid that contacts the top of the die, and how much hotter...
Feb 6, 2026
I don't think any benefits have been confirmed, not even a publication with simulations.
Feb 5, 2026
Xebec reacted to IanD's post in the thread Intel’s 18A rumors meet a thermal brick wall says SemiWiki with
Like.
The issue is how cool you have to keep the lower face of the heatsink/package lid that contacts the top of the die, and how much hotter...
user nl posted the thread Winners and Losers by SemiAnalysis: Claude Code is the Inflection Point in SemiWiki Main Forum ( Ask the Experts! ).Interesting story, partially open in the newsletter of SemiAnalysis about Claude Code: Feb 05, 2026 Doug O'Laughlin, Jeremie Eliahou...