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The future of glass substrate in Intel

Y.H

Member

Intel’s Former ‘Inventor of The Year’, Who Specialized In Glass Substrates, Has Now Joined Samsung, Showing that Team Blue is Ready to Abandon Its Core Team & Vision​


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Intel might have lost a major talent with its recent moves, as the company's core employee responsible for glass substrates and the EMIB technology has now joined rival Samsung.

Intel's Prospects Towards Entering the Glass Substrate Segment Are Gloomy For Now, Despite Years of Lead​

Team Blue has made some of the more drastic decisions with the company's structuring and vision in recent times, which are mainly driven by a single unified goal: to reduce operating losses and increase shareholder value. Achieving this objective has brought in cancellation of optimistic projects, large-scale layoffs, and more importantly, key personalities moving from the company, and one such example is Gang Duan, who is a former principal engineer at Intel, responsible for Substrate Packaging Technology.

 
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