You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!
I need to design IO PADS for 180nm,
please provide me required stuff for the same.
What are the design criteria for designing IO PADS?
What is the relation of package and PADS?
In my experience this varies from foundry to foundry,
and even flow to flow. I get pad construction rules
as part of the PDK from the foundry I currently am at.
Your pad size and pitch are set based on the assembly
and wafer probe you intend to use, along with what the
foundry thinks makes its pad-stack robust. You need to
comprehend and meet both sets of constraints.
Even with prior guidance you may expect that the foundry
will want to review your handmade pad construction (if
you elect not to use the prequalified "esd" library and its
input, output, power, ground pads (as many RF folks must,
to get performance in the signal path). Take advantage
of that early as possible, outside the tapeout path.
I need to design Padring from scratch.
I don't have much knowledge of PAD design,
I am using cadence gpdk 180nm, no any foundry specific models available with me.
It would be better for me if anyone share a detail building blocks of IO - PAD design tutorial.
What are the design consideration of each block?
Please provide me tha name of book for the same.
The following text is a reasonably good starting point for learning about CMOS I/O design.
Dabral, S. and Maloney, T., Basic ESD and I/O Design, Wiley & Sons, 1998.