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You heard it here first: AMD $AMD is planning to use Intel $INTC foundry to manufacture chips in the USA (not just packaging). During my job listing research, I uncovered a job listing posted by AMD that mentions Intel’s “PowerVia” under preferred experience… This is HUGE!
(PowerVia is Intel's groundbreaking backside power delivery technology, a chipmaking innovation that moves power and ground connections to the back of the chip, separating them from data signals for better performance, efficiency, and density, debuting in Intel 20A and optimized for 18A. It's a key part of Intel's strategy to regain process leadership, working with their new RibbonFET transistors.)
Hard to believe AMD would give up first class flying at TSMC. They can make wafers at TSMC in AZ all day long. I bet TSMC AZ will double in size much faster than expected due to the made in America push.
Hard to believe AMD would give up first class flying at TSMC. They can make wafers at TSMC in AZ all day long. I bet TSMC AZ will double in size much faster than expected due to the made in America push.
Hard to believe AMD would give up first class flying at TSMC. They can make wafers at TSMC in AZ all day long. I bet TSMC AZ will double in size much faster than expected due to the made in America push.
It could be as simple as AMD is planning to do backside power in future with TSMC. So recruiting people who have experience in this area who have worked for/with Intel -- would be good experience to have as they plan for TSMC backside power.
