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Intel is industry’s first mover on High NA EUV lithography system.

Daniel Nenni

Daniel Nenni

Admin
Staff member
Intel Foundry has received and assembled the industry’s first High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography system. The new tool provides the ability to dramatically improve resolution and feature scaling for the next generation of processors, enabling Intel Foundry to continue process leadership beyond Intel 18A.
High NA EUV is the next-generation lithography system developed by ASML following decades of collaboration with Intel. As the first mover on High NA EUV, Intel Foundry will be able to deliver never-before-seen precision and scalability in chip manufacturing. This in turn will allow Intel to develop chips with the most innovative features and capabilities – processors that are essential for driving advancements in AI and other emerging technologies.

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Infographic​



high na euv infographic



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Images​

newsroom-intel-high-na-euv-4.jpg.rendition.intel.web.1648.927.jpg


In the clean room of Intel Corporation's Fab D1X in Hillsboro, Oregon, Intel Fellow Mark Phillips briefs media on the company's High Numerical Aperture Extreme Ultraviolet lithography tool. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-5.jpg.rendition.intel.web.1648.927.jpg


In the clean room of Intel Corporation's Fab D1X in Hillsboro, Oregon, Intel Fellow Mark Phillips briefs media on the company's High Numerical Aperture Extreme Ultraviolet lithography tool. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-1.jpg.rendition.intel.web.1648.927.jpg


Installation is complete and calibration started on Intel's High Numerical Aperture Extreme Ultraviolet lithography tool in a clean room at Intel Corporation's Fab D1X in Hillsboro, Oregon, in April 2024. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system of its kind in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-2.jpg.rendition.intel.web.1648.927.jpg


Installation is complete and calibration started on Intel's High Numerical Aperture Extreme Ultraviolet lithography tool in a clean room at Intel Corporation's Fab D1X in Hillsboro, Oregon, in April 2024. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system of its kind in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-3.jpg.rendition.intel.web.1648.927.jpg


Installation is complete and calibration started on Intel's High Numerical Aperture Extreme Ultraviolet lithography tool in a clean room at Intel Corporation's Fab D1X in Hillsboro, Oregon, in April 2024. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system of its kind in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-4.jpg.rendition.intel.web.1648.927.jpg


In the clean room of Intel Corporation's Fab D1X in Hillsboro, Oregon, Intel Fellow Mark Phillips briefs media on the company's High Numerical Aperture Extreme Ultraviolet lithography tool. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-5.jpg.rendition.intel.web.1648.927.jpg


In the clean room of Intel Corporation's Fab D1X in Hillsboro, Oregon, Intel Fellow Mark Phillips briefs media on the company's High Numerical Aperture Extreme Ultraviolet lithography tool. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-1.jpg.rendition.intel.web.1648.927.jpg


Installation is complete and calibration started on Intel's High Numerical Aperture Extreme Ultraviolet lithography tool in a clean room at Intel Corporation's Fab D1X in Hillsboro, Oregon, in April 2024. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system of its kind in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)

newsroom-intel-high-na-euv-2.jpg.rendition.intel.web.1648.927.jpg


Installation is complete and calibration started on Intel's High Numerical Aperture Extreme Ultraviolet lithography tool in a clean room at Intel Corporation's Fab D1X in Hillsboro, Oregon, in April 2024. The 165-ton High NA EUV tool was built by ASML and is the first commercial lithography system of its kind in the world. The machine will allow Intel Foundry to continue its pursuit of Moore's Law by creating for its customers powerful chips with ever-smaller transistors. (Credit: Intel Corporation)





Download all images (ZIP, 23 MB)


Intel Adds ASML’s First High NA EUV Tool to Oregon Factory
ASML’s High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography scanner sits in Intel Oregon’s D1X test manufacturing factory, where it is going through its final calibration. It is as big as a double-decker bus and weighs as much as a blue whale. It will shoot lasers at light speed and heat plasma to nearly 220,000 degrees Celsius, almost 40 times hotter than the surface temperature of the sun. The new TWINSCAN EXE: 5000 has the ability to dramatically improve resolution feature scaling for next-generation processors and will enable the continued pursuit of Moore’s Law. (Credit: Intel Corporation)

www.intel.com

High NA EUV at Intel

Intel is industry’s first mover on High NA EUV lithography system.
www.intel.com www.intel.com
 
Mooredaddy said:
Intel seems to be positioning this to make it seem like having High NA EUV is going to catapult them to the front of tech leadership. Narrative may work on the unsophisticated...
Click to expand...

Intel can make CPU chiplets in OR using HNA EUV and be the first. TSMC will be the first to full chip HNA EUV with Apple. My guess.

I’m wondering how many systems TSMC will need? And when will ASML be able to deliver them?
 
Many years ago Intel was the unquestioned leader and made the fatal decision to stick to DUV while another embraced EUV and ran away with leadership.

It is interesting that Intel makes all this noise and seems hell bent to be first and the leaders is oddly quiet.

Is the show moved to the other foot here, LOL
 
TBiggs said:
Many years ago Intel was the unquestioned leader and made the fatal decision to stick to DUV while another embraced EUV and ran away with leadership.
Click to expand...
Not using EUV for 10nm was (and even with the benefit of hindsight still is) objectively the correct decision, no ifs thens or buts. Even if ASML had the tools in 2018 to fully equip intel at the expensive of Samsung and TSMC for volume production in 2019 (Icelake), then 10nm would have been just as if not more late than what actually occurred.
TBiggs said:
It is interesting that Intel makes all this noise and seems hell bent to be first and the leaders is oddly quiet.

Is the show moved to the other foot here, LOL
Click to expand...
I don't read it like that at all. 14A is not the same node as N2 or N1.4. What makes sense for one doesn't necessarily make sense for the other. Additionally per intel's own charts their ramps are slower than what TSMC does or what intel used to do so that is another difference that could impact the decision of what node to use high-NA on.

With all of this said we also need to consider time to market. N2 products won't be launching until 2026, so unless N2 is some 10FF like stepping stone, the earliest we should expect N1.4 is 2028 (and maybe even 2029 if TSMC continues with the 5 year development cycles that they unintentionally did with N3 and intentionally did with N2). Assuming TSMC also adopts high-NA where it is useful for this node, then TSMC isn't "behind" in anything. That is just the earliest intercept with ASML's roadmap. Obviously PR wise it looks bad and folks might foolishly call it a "mistake" on TSMC's part if intel doesn't have any high-NA related stumbles, but I think calling it a mistake would be an incorrect assessment given the fact there is no earlier intercept without doing some waste of time N2+ nodelet that nobody would use long term.
 
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Daniel Nenni said:
Intel can make CPU chiplets in OR using HNA EUV and be the first. TSMC will be the first to full chip HNA EUV with Apple. My guess.

I’m wondering how many systems TSMC will need? And when will ASML be able to deliver them?
Click to expand...
Wait until they consider NVIDIA's (or their own) large dies.
 
High-NA customers need some strategy for the mask as well. Multilayer, absorber, and Intel now wants to change mask size as well (they didn't plan it with ASML earlier)?
 
Hats off (again) to the engineers behind all of this tech. Imagine sending this back in time and showing to Gordon Moore in 1965, or Shockley in 1949.

On the video I think it’s reasonable as it’s intended for investors and the public. “This technology is a work of art, Intel is first to use it, it’s taken decades of effort to get here”.
 
Fred Chen said:
"High NA EUV is the next-generation lithography system developed by ASML following decades of collaboration with Intel."

A misleading statement from Intel, as if they co-owned it for decades.
Click to expand...
No,Intel still owns 3% of asml, use to own even more.
From wikipedia:
"In 1997, ASML began studying a shift to using extreme ultraviolet and in 1999 joined a consortium including Intel, two other U.S. chipmakers, in order to exploit fundamental research conducted by the US Department of Energy. Because of the CRADA it operates under is funded by the US taxpayer, licensing must be approved by Congress. It collaborated with the Belgian Imec and Sematech and turned to Carl Zeiss in Germany for its need of mirrors.".
 
peteryzhang said:
No,Intel still owns 3% of asml, use to own even more.
From wikipedia:
"In 1997, ASML began studying a shift to using extreme ultraviolet and in 1999 joined a consortium including Intel, two other U.S. chipmakers, in order to exploit fundamental research conducted by the US Department of Energy. Because of the CRADA it operates under is funded by the US taxpayer, licensing must be approved by Congress. It collaborated with the Belgian Imec and Sematech and turned to Carl Zeiss in Germany for its need of mirrors.".
Click to expand...

Samsung, TSMC and Intel all invested in ASLM:

www.zdnet.com

TSMC to invest $1.4B in ASML chip kit, stake

Taiwan Semiconductor Manufacturing Company agrees to buy 5 percent stake for US$1.03 billion, and invest US$342 million for R&D in ASML's next-generation lithography technologies.
www.zdnet.com www.zdnet.com

Samsung invests $976 million in ASML for tech to build smaller chips

Following Intel and contract chip maker Taiwan Semiconductor Manufacturing Co. (TSMC), Samsung Electronics will invest €779 million (US$976 million) in the Dutch chip manufacturing equipment maker ASML to further development of next-generation lithography technology that should enable faster and...
www.computerworld.com www.computerworld.com


It took a village to bring EUV to market and let's not forget that TSMC was the first to successfully bring EUV to the foundry business.
 
Daniel Nenni said:
Samsung, TSMC and Intel all invested in ASLM:

www.zdnet.com

TSMC to invest $1.4B in ASML chip kit, stake

Taiwan Semiconductor Manufacturing Company agrees to buy 5 percent stake for US$1.03 billion, and invest US$342 million for R&D in ASML's next-generation lithography technologies.
www.zdnet.com www.zdnet.com

Samsung invests $976 million in ASML for tech to build smaller chips

Following Intel and contract chip maker Taiwan Semiconductor Manufacturing Co. (TSMC), Samsung Electronics will invest €779 million (US$976 million) in the Dutch chip manufacturing equipment maker ASML to further development of next-generation lithography technology that should enable faster and...
www.computerworld.com www.computerworld.com


It took a village to bring EUV to market and let's not forget that TSMC was the first to successfully bring EUV to the foundry business.
Click to expand...

In 2012 Intel invested the largest amount of money ($4.1 billion) in ASML along with Samsung ($970 million ) and TSMC ($1.4 billion). But Intel is the last one to start using EUV machine at its fab in Ireland in September 2023. It's about 4 years after TSMC's EUV HVM in 2019. And Intel owns the smallest number of EUV machine among TSMC, Samsung, and Intel.

Strangely Intel is more like an outsider despite that at one point it owned 15% of ASML and collaborated with ASML, TSMC, Samsung to bring EUV to the real world.
 
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peteryzhang said:
No,Intel still owns 3% of asml, use to own even more.
From wikipedia:
"In 1997, ASML began studying a shift to using extreme ultraviolet and in 1999 joined a consortium including Intel, two other U.S. chipmakers, in order to exploit fundamental research conducted by the US Department of Energy. Because of the CRADA it operates under is funded by the US taxpayer, licensing must be approved by Congress. It collaborated with the Belgian Imec and Sematech and turned to Carl Zeiss in Germany for its need of mirrors.".
Click to expand...
Investment is not collaboration; the statement implied 30 years of continued hands-on collaboration with Intel on the project.
 
Fred Chen said:
Keeping things off the cloud would require lots of DRAM at the client side.
Click to expand...

Intel and Pat Gelsinger like to promote the "AI PC" idea and try to convince Corporate CIOs that this is the most efficient and secured way to use AI.

I don't understand this assertion with only limited details published. For example, AI PC may help AI inference operations but I don't have a clear picture how AI PC can help AI training that needs a lot of data, memory, and storage. AI PCs don't have that kind of environment to begin with.

Also, companies do not like their data scattered to hundreds or thousands of PCs and locations. There are just too many potential data leaks or vulnerabilities for them to deal with. How can AI PC everywhere make AI and the data safer and more efficient as Pat Gelsinger claimed?

Additionally, Pat likes to tell the audience that AI servers consume too much electricity, generate too much heat and need a lot of data center space and operation support. That's very true. But can some explain to me how 100 million or 200 million AI PCs will make the situation better?
 
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hist78 said:
Intel and Pat Gelsinger like to promote the "AI PC" idea and try to convince Corporate CIOs that this is the most efficient and secured way to use AI.

I don't understand this assertion with only limited details published. For example, AI PC may help AI inference operations but I don't have a clear picture how AI PC can help AI training that needs a lot of data, memory, and storage. AI PCs don't have that kind of environment to begin with.

Also, companies do not like their data scattered to hundreds or thousands of PCs and locations. There are just too many potential data leaks or vulnerabilities for them to deal with. How can AI PC everywhere make AI and the data safer and more efficient as Pat Gelsinger claimed?

Additionally, Pat likes to tell the audience that AI servers consume too much electricity, generate too much heat. and need a lot of data center space and operation support. That's very true. But can some explain to me how 100 million or 200 million AI PCs will make the situation better?
Click to expand...
I feel "AI PC" is only a way that Intel desperately to get some crumble from the AI pie Nvidia grabs most.
 
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