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Recent content by hist78

  1. hist78

    TSMC says 'A16' chipmaking tech to arrive in 2026, setting up showdown with Intel

    "So I have two questions: When will HNA-EUV be production ready? When will ASML ship the systems required for Intel, Samsung, and TSMC to do HVM?" This is a billion dollar question.
  2. hist78

    TSMC says 'A16' chipmaking tech to arrive in 2026, setting up showdown with Intel

    According to this graph, there isn't much time left (1.5 to 2 years) before starting Hi-NA EUV HVM. If ASML can't meet that target, can Intel scale back to the low NA EUV tools for Intel 14A?
  3. hist78

    TSMC says 'A16' chipmaking tech to arrive in 2026, setting up showdown with Intel

    If I understand what you have said, Intel can successfully adopt Hi-NA tools by 2026/2027 under strictly Intel defined criteria? But Intel can only control what they can control, not much for those issues inside ASML or ASML's suppliers.
  4. hist78

    TSMC says 'A16' chipmaking tech to arrive in 2026, setting up showdown with Intel

    It's a very different risk management attitude between Intel and TSMC. Intel believes in two years ASML, various ASML partners and Intel itself will sort out all the issues related to Hi-NA tools while TSMC plans to go live in A16 without using Hi-NA. Do you think Intel is too optimistic or...
  5. hist78

    TSMC says 'A16' chipmaking tech to arrive in 2026, setting up showdown with Intel

    The 2H2026 target for TSMC A16 production is critical because Intel's 14A with Hi-NA will be coming out more or less the same time. That means for all those who want to be on the leading edge nodes, they must make the decision now, if they haven't done so. My thought is unless the fabless...
  6. hist78

    TSMC's New N4C

    TSMC Arizona Fab 1 coming to HVM next year is for N5/N4 with only 20,000 300mm wafers per month. The "low volume" orders from Apple, AMD, Nvidia, Qualcomm, and Broadcom's need to put into perspective. It's because combining each of those big companies' "low volume" orders can be big enough to...
  7. hist78

    TSMC's New N4C

    I was talking about N5/N4 nodes used at TSMC Arizona Fab 1. There are plenty of products across AMD, Nvidia, Qualcomm, Broadcom, and Apple using N5/N4 technology. Apple alone has several A, M, H, R, and S series processors manufactured with N5/N4. N5/N4 will be a long-lived foundry node at...
  8. hist78

    TSMC's New N4C

    We can do some calculations to see if this US pricing is feasible. Here are some facts and assumptions: 1. Apple sold 427.1 million units of devices globally in 2023 on iPhone (231.8 million), iPad (135.3 million), Mac PCs (24 million), and Apple Watches (36 million, estimated). 2. TSMC...
  9. hist78

    TSMC's New N4C

    The US pricing strategy will have a high possibility to succeed because TSMC Arizona fab capacity is relatively smaller than TSMC's Gigafabs. The first two fabs will have a combined capacity of 50,000 wafers per month. Under the political and strategic consideration, Apple, Qualcomm, Nvidia...
  10. hist78

    Intel first quarter 2024 earnings of

    "The foundry market is expected to grow from $110 billion today to $240 billion by 2030 with almost 90% of the growth coming from EUV nodes and advanced packaging. Given this backdrop, we have clear line-of-sight to becoming the largest system foundry for the AI era and the second-largest...
  11. hist78

    Intel is industry’s first mover on High NA EUV lithography system.

    Intel and Pat Gelsinger like to promote the "AI PC" idea and try to convince Corporate CIOs that this is the most efficient and secured way to use AI. I don't understand this assertion with only limited details published. For example, AI PC may help AI inference operations but I don't have a...
  12. hist78

    Intel is industry’s first mover on High NA EUV lithography system.

    "Machine at Intel's Hillsboro campus can produce chips so advanced, they don't yet exist."
  13. hist78

    Intel is industry’s first mover on High NA EUV lithography system.

    In 2012 Intel invested the largest amount of money ($4.1 billion) in ASML along with Samsung ($970 million ) and TSMC ($1.4 billion). But Intel is the last one to start using EUV machine at its fab in Ireland in September 2023. It's about 4 years after TSMC's EUV HVM in 2019. And Intel owns...
  14. hist78

    TSMC Q1 2024 Discussion

    During the conference call TSMC did say the smartphone sector is weak but overall revenue got help from the strong AI/high performance computing orders. While most TSMC's AI and high performance computing clients are using N7/N5/N4, leading edge smartphone processors are using N3. Weak...
  15. hist78

    Intel is industry’s first mover on High NA EUV lithography system.

    How can I say? 🤷🤦
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