Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/threads/tsmc-to-build-9-facilities-in-2025-sub-2nm-production-set-for-taichung-by-2028.22827/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2021770
            [XFI] => 1050270
        )

    [wordpress] => /var/www/html
)

TSMC to Build 9 Facilities in 2025, Sub-2nm Production Set for Taichung by 2028

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Amid tariff pressures, TSMC is ramping up new capacity both at home and overseas. According to CNA and MoneyDJ, the foundry giant plans to build nine new facilities in 2025—eight fabs and one advanced packaging plant—across its global footprint.

Most of the newly added capacities will feature 2nm and more advanced nodes, as highlighted by the reports. Notably, the reports suggest that Fab 25 in Taichung is set to break ground by year-end and begin producing chips more advanced than 2nm by 2028.

In addition, TSMC plans to build five fabs in Kaohsiung, Southern Taiwan, supporting 2nm, A16, and future leading-edge nodes, as per CNA.

Citing TSMC VP T.S. Chang at the company’s 2025 Technology Symposium, the reports indicate that TSMC built an average of three fabs per year from 2017 to 2020. That jumped to five per year between 2021 and 2024—and is set to climb even higher in 2025, Chang noted.

With 2nm set to enter mass production in 2H25, TSMC will tap Fab 20 in Hsinchu and Fab 22 in Kaohsiung—both launched in 2022—as its key 2nm production sites, the reports say.

SoIC/ CoWoS Capacity Set for Explosive Growth Through 2026

Meanwhile, TSMC is making strides in overseas expansion. Liberty Times reports its Arizona and Kumamoto fabs are already up and running, with a second Japan fab breaking ground later this year. In April, NVIDIA revealed it’s already rolling out its Blackwell AI GPUs from TSMC’s Phoenix plant.

In terms of the progress on 3nm, which has kicked off mass production three years ago, TSMC expects its 3nm capacity to grow over 60% this year, as noted by KNEWS. The company offers multiple 3nm variants—N3E, N3P, and N3X—to meet diverse customer needs, and has begun shipping 3nm chips for automotive battery applications this year, the report adds.

In addition, to keep pace with surging demand from HPC and AI clients, TSMC is also scaling up its advanced packaging capacity. According to Liberty Times, TSMC expects its SoIC capacity to grow at a compound annual rate of over 100% from 2022 to 2026, while CoWoS capacity is projected to expand by more than 80% over the same period.
 
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