Silicon Valley, CA – May 15, 2025 – Silicon Catalyst, the only incubator + accelerator focused on the global semiconductor industry, including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum, announces the admission of five companies into the semiconductor industry’s highly acclaimed program.
Silicon Catalyst has developed an unparalleled support ecosystem for its semiconductor start-ups, providing a strong network of Strategic Partners, technical and business advisors, investors and industry professionals who help companies launch and scale in the market. In addition, the incubator’s In-Kind Partners provide privileged access to services, expertise, and intellectual property that can help commercialize their companies’ technological innovation.
Black Solution Nanotech - https://blacksolnano.com/ Taiwan
CEO: Zach Wu zach@blacksolnano.com
Revolutionary metamaterial for EMI Absorption & Thermal Management
With more than 10 years of experience in nanotechnology research and commercialization, our mission is to help our customers apply the extraordinary properties of metamaterials across a broad spectrum of products and devices. Our core competencies lie in lowering the cost of carbon nanomaterials to highly competitive levels and in designing and assembling carbon materials into innovative structures and solutions that allow our customers to solve real-world problems. Through hard work and dedication, we have become experts in all facets of carbon nano solutions manufacture, including films, polymer composites, coatings, pastes, and powders, with a particular focus on carbon nanocomposite solutions. Our patented and novel EMI Shield product is one in a series of products our customers rely on to enhance their competitive edge in the marketplace.
Edgewater Wireless – edgewaterwireless.com Canada
CEO: Andrew Skafel, andrews@edgewaterwireless.com
We make Wi-Fi. Better.
Edgewater Wireless is redefining Wi-Fi from the silicon up—delivering standards-leading innovations that create strategic value for next-generation connectivity platforms and semiconductor licensing partners. With 26 granted patents and a fabless business model, Edgewater Wireless pioneered Wi-Fi Spectrum Slicing, a breakthrough technology purpose built to address the surging global demand for higher-capacity, lower-latency wireless networks. Edgewater is supercharging the economics of Wi-Fi. At a time when incremental performance gains are no longer enough, Spectrum Slicing offers a transformative leap: enabling multiple concurrent channels within a single frequency band. The result— 10x or greater performance and 50% lower latency—benefits all devices, including legacy hardware, without requiring changes to the client side. This architecture delivers scalable, infrastructure-friendly gains across residential, enterprise, and IoT environments. Our technology is deeply aligned with the evolving IEEE standards and shaped by collaboration with Tier-one service providers, enterprises and CableLabs.
Gigantor Technologies – www.gigantor.com USA
CEO: Don Gaspar don@gigantor.tech
Giants of Edge AI Acceleration
It's more than just a new circuitry design – it's a complete reimagining of the architecture for AI processing. At the heart of the GigaMAACS System is our patented parallel pipeline design. This innovative approach enables a level of performance and speed previously unattainable. It's not just faster; it provides consistent, real-time operation with near-zero latency, huge power reduction and transforming how we think about inference performance in AI applications on the Edge. With the GigaMAACS System, we're not just pushing the boundaries of what's possible in AI – we're redefining them.
HEPT Lab - www.heptlab.com USA
CEO: Aroutin Khachatruian aroutin@heptlab.com
Next Generation Perception for Autonomy
HEPT Lab is developing a fully solid-state, coherent 3D image sensor, the size of an Apple Airpod case, to enable autonomous devices. Our solution is resilient to harsh conditions such as bright light, dust and fog, critical for Automotive, Agtech, Robotics and Drone markets. Equally important for these markets are small size, low power and low cost. HEPT Lab’s solution combines three classes of in-house designed semiconductor devices assembled into one multi-chiplet sensor solution to achieve these requirements. A custom silicon photonic ASIC implements solid-state beam steering and coherent imaging architecture, multiple analog CMOS devices interface with the silicon photonic core and a custom InP photonic ASIC generates and conditions the laser signal.
TeraSpatial www.teraspatial.ai USA
CEO: Dr. Cormac Conroy cormac.conroy@teraspatial.ai
Solving the wireless connectivity bottleneck for AI data movement
TeraSpatial is transforming wireless infrastructure with its dual-use TeraHaul™ product
family, unleashing the physics-based advantages of millimeter wave – including ultra-high capacity, plentiful spectrum, massive bandwidth, anti-jamming capability, and compact form factor – to overcome the AI data movement bottleneck and deliver 10X the capacity of legacy wireless systems, with improved coverage and reduced latency. Powered by patented silicon, software, and embedded AI/ML, the TeraHaul™ platform uniquely delivers simultaneous Point-to-Multipoint connectivity with precision beamforming and a built-in Wireless Digital Twin engine that models the RF environment in real time, enabling AI-driven, site-specific awareness and dynamic adaptation.
About Silicon Catalyst “it’s about what’s next®”
Silicon Catalyst is the only incubator + accelerator focused on the Global Semiconductor Industry including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum. More than 1,500 startup companies worldwide have engaged with Silicon Catalyst and the company has admitted over 150 exciting companies. With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization. The incubator + accelerator supplies startups with access to design tools, silicon devices, networking, and a path to funding, banking and marketing acumen to successfully launch and grow their company’s novel technology solutions. Over the past ten years, the Silicon Catalyst model has been proven to dramatically accelerate a startup’s trajectory while at the same time de-risking the equation for investors.
The Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed-stage and Series A funding for Silicon Catalyst Portfolio Companies. SiliconCatalyst.UK, a subsidiary of Silicon Catalyst, was selected by the UK government to manage ChipStart UK, an early-stage semiconductor incubator funded by the UK government.
In February of 2024, Silicon Catalyst Ventures (SCV) was launched to fund early-stage startups accepted into the incubator’s two-year program. SCV has already made 26 investments in Silicon Catalyst Portfolio Companies.
More information is available at www.siliconcatalyst.com, www.siliconcatalystangels.com, www.siliconcatalyst.uk, and Silicon Catalyst Ventures www.sicatalystvc.com.
For further information, contact:
Silicon Catalyst LLC
Richard Curtin, Managing Partner, richard@sicatalyst.com
SiliconCatalyst.UK
Sean Redmond, Managing Partner, sean@siliconcatalyst.com
Silicon Catalyst has developed an unparalleled support ecosystem for its semiconductor start-ups, providing a strong network of Strategic Partners, technical and business advisors, investors and industry professionals who help companies launch and scale in the market. In addition, the incubator’s In-Kind Partners provide privileged access to services, expertise, and intellectual property that can help commercialize their companies’ technological innovation.
- Black Solution Nanotechnology - Revolutionary Metamaterial for EMI Absorption
- Edgewater Wireless - We make Wi-Fi. Better.
- Gigantor Technologies - Giants of Edge AI Acceleration
- HEPT Lab - Next Generation Perception for Autonomy
- TeraSpatial - Solving the wireless connectivity bottleneck for AI data movement
Black Solution Nanotech - https://blacksolnano.com/ Taiwan
CEO: Zach Wu zach@blacksolnano.com
Revolutionary metamaterial for EMI Absorption & Thermal Management
With more than 10 years of experience in nanotechnology research and commercialization, our mission is to help our customers apply the extraordinary properties of metamaterials across a broad spectrum of products and devices. Our core competencies lie in lowering the cost of carbon nanomaterials to highly competitive levels and in designing and assembling carbon materials into innovative structures and solutions that allow our customers to solve real-world problems. Through hard work and dedication, we have become experts in all facets of carbon nano solutions manufacture, including films, polymer composites, coatings, pastes, and powders, with a particular focus on carbon nanocomposite solutions. Our patented and novel EMI Shield product is one in a series of products our customers rely on to enhance their competitive edge in the marketplace.
Edgewater Wireless – edgewaterwireless.com Canada
CEO: Andrew Skafel, andrews@edgewaterwireless.com
We make Wi-Fi. Better.
Edgewater Wireless is redefining Wi-Fi from the silicon up—delivering standards-leading innovations that create strategic value for next-generation connectivity platforms and semiconductor licensing partners. With 26 granted patents and a fabless business model, Edgewater Wireless pioneered Wi-Fi Spectrum Slicing, a breakthrough technology purpose built to address the surging global demand for higher-capacity, lower-latency wireless networks. Edgewater is supercharging the economics of Wi-Fi. At a time when incremental performance gains are no longer enough, Spectrum Slicing offers a transformative leap: enabling multiple concurrent channels within a single frequency band. The result— 10x or greater performance and 50% lower latency—benefits all devices, including legacy hardware, without requiring changes to the client side. This architecture delivers scalable, infrastructure-friendly gains across residential, enterprise, and IoT environments. Our technology is deeply aligned with the evolving IEEE standards and shaped by collaboration with Tier-one service providers, enterprises and CableLabs.
Gigantor Technologies – www.gigantor.com USA
CEO: Don Gaspar don@gigantor.tech
Giants of Edge AI Acceleration
It's more than just a new circuitry design – it's a complete reimagining of the architecture for AI processing. At the heart of the GigaMAACS System is our patented parallel pipeline design. This innovative approach enables a level of performance and speed previously unattainable. It's not just faster; it provides consistent, real-time operation with near-zero latency, huge power reduction and transforming how we think about inference performance in AI applications on the Edge. With the GigaMAACS System, we're not just pushing the boundaries of what's possible in AI – we're redefining them.
HEPT Lab - www.heptlab.com USA
CEO: Aroutin Khachatruian aroutin@heptlab.com
Next Generation Perception for Autonomy
HEPT Lab is developing a fully solid-state, coherent 3D image sensor, the size of an Apple Airpod case, to enable autonomous devices. Our solution is resilient to harsh conditions such as bright light, dust and fog, critical for Automotive, Agtech, Robotics and Drone markets. Equally important for these markets are small size, low power and low cost. HEPT Lab’s solution combines three classes of in-house designed semiconductor devices assembled into one multi-chiplet sensor solution to achieve these requirements. A custom silicon photonic ASIC implements solid-state beam steering and coherent imaging architecture, multiple analog CMOS devices interface with the silicon photonic core and a custom InP photonic ASIC generates and conditions the laser signal.
TeraSpatial www.teraspatial.ai USA
CEO: Dr. Cormac Conroy cormac.conroy@teraspatial.ai
Solving the wireless connectivity bottleneck for AI data movement
TeraSpatial is transforming wireless infrastructure with its dual-use TeraHaul™ product
family, unleashing the physics-based advantages of millimeter wave – including ultra-high capacity, plentiful spectrum, massive bandwidth, anti-jamming capability, and compact form factor – to overcome the AI data movement bottleneck and deliver 10X the capacity of legacy wireless systems, with improved coverage and reduced latency. Powered by patented silicon, software, and embedded AI/ML, the TeraHaul™ platform uniquely delivers simultaneous Point-to-Multipoint connectivity with precision beamforming and a built-in Wireless Digital Twin engine that models the RF environment in real time, enabling AI-driven, site-specific awareness and dynamic adaptation.
About Silicon Catalyst “it’s about what’s next®”
Silicon Catalyst is the only incubator + accelerator focused on the Global Semiconductor Industry including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum. More than 1,500 startup companies worldwide have engaged with Silicon Catalyst and the company has admitted over 150 exciting companies. With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization. The incubator + accelerator supplies startups with access to design tools, silicon devices, networking, and a path to funding, banking and marketing acumen to successfully launch and grow their company’s novel technology solutions. Over the past ten years, the Silicon Catalyst model has been proven to dramatically accelerate a startup’s trajectory while at the same time de-risking the equation for investors.
The Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed-stage and Series A funding for Silicon Catalyst Portfolio Companies. SiliconCatalyst.UK, a subsidiary of Silicon Catalyst, was selected by the UK government to manage ChipStart UK, an early-stage semiconductor incubator funded by the UK government.
In February of 2024, Silicon Catalyst Ventures (SCV) was launched to fund early-stage startups accepted into the incubator’s two-year program. SCV has already made 26 investments in Silicon Catalyst Portfolio Companies.
More information is available at www.siliconcatalyst.com, www.siliconcatalystangels.com, www.siliconcatalyst.uk, and Silicon Catalyst Ventures www.sicatalystvc.com.
For further information, contact:
Silicon Catalyst LLC
Richard Curtin, Managing Partner, richard@sicatalyst.com
SiliconCatalyst.UK
Sean Redmond, Managing Partner, sean@siliconcatalyst.com