Celebrating its tenth anniversary, 3D Architectures for Semiconductor Integration and Packing (3D ASIP) is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena.
3D ASIP targets senior-level technologists, managers, and executives as speakers and attendees from leading companies and organizations from around the world, and strives to serve the needs of the entire 3D supply chain, from technology developers to equipment and materials suppliers to designers, manufacturers, and end users. All speakers are invited.
The format of the conference and its presentations enable speakers to present the most up-to-date and forthright perspectives possible, and gives exceptional opportunities to network with and learn from other senior-level technology and business leaders.
The full program for the 10th International 3D ASIP Conference, December 11-13 at the Hyatt Regency San Francisco Airport Hotel, is now available on the conference website. The agenda includes presentations by over 30 invited speakers in the 2.5/3D arena representing leading companies, universities, and research organizations from around the world. The conference format offers attendees a platform to gain the latest information on technology progress and industry trends that are shaping the opportunities today and tomorrow.
Registration is open and early-registration rates are available until November 1. Visit the website and register today! Discounts are also available for corporate groups of two or more, as well as for attendees from government and academia.
All participants at 3D ASIP - Speakers, Attendees, Sponsors, and Exhibitors - have exceptional opportunities to network with and learn from a concentrated audience of senior-level technologists and business leaders in the 3D community. This is an outstanding forum to gain exposure for your company.
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3D ASIP targets senior-level technologists, managers, and executives as speakers and attendees from leading companies and organizations from around the world, and strives to serve the needs of the entire 3D supply chain, from technology developers to equipment and materials suppliers to designers, manufacturers, and end users. All speakers are invited.
The format of the conference and its presentations enable speakers to present the most up-to-date and forthright perspectives possible, and gives exceptional opportunities to network with and learn from other senior-level technology and business leaders.
The full program for the 10th International 3D ASIP Conference, December 11-13 at the Hyatt Regency San Francisco Airport Hotel, is now available on the conference website. The agenda includes presentations by over 30 invited speakers in the 2.5/3D arena representing leading companies, universities, and research organizations from around the world. The conference format offers attendees a platform to gain the latest information on technology progress and industry trends that are shaping the opportunities today and tomorrow.
Registration is open and early-registration rates are available until November 1. Visit the website and register today! Discounts are also available for corporate groups of two or more, as well as for attendees from government and academia.
All participants at 3D ASIP - Speakers, Attendees, Sponsors, and Exhibitors - have exceptional opportunities to network with and learn from a concentrated audience of senior-level technologists and business leaders in the 3D community. This is an outstanding forum to gain exposure for your company.
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