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Search results

  1. Daniel Payne

    1.2 Trillion transistor chip? Yes - Cerebras

    OK, just read the article at https://www.anandtech.com/show/14758/hot-chips-31-live-blogs-cerebras-wafer-scale-deep-learning, where it shows die mounted to a substrate, now that makes sense.
  2. Daniel Payne

    1.2 Trillion transistor chip? Yes - Cerebras

    Yes, chiplets is an approach, however this is never mentioned in any of the public Cerebras information. Do you have some private insight?
  3. Daniel Payne

    1.2 Trillion transistor chip? Yes - Cerebras

    Cerebras used a TSMC 16nm process, but somehow they worked to increase the reticle size beyond 32mm x 26mm to fill an entire wafer, or it's likely that they did multiple exposures at the maximum reticle size. I really haven't heard of other fabs doing full-wafer chips because the yield...
  4. Daniel Payne

    1.2 Trillion transistor chip? Yes - Cerebras

    Arthur, we have to wait for Cerebras to disclose more details at the Hot Chips conference, so this is quite the accomplishment to actually get yield on a 16nm Wafer Scale Integration (WSI) project. At Intel there was research into WSI going back to 1978, but the equations predicted that you...
  5. Daniel Payne

    1.2 Trillion transistor chip? Yes - Cerebras

    Yeah, the largest wafer-scale chip on the planet award goes to Cerebras at 1.2 trillion transistors. Aimed at speeding up ML operations, this is outrageously interesting. In theory as a die size increases the yield should approach zero, so how did Cerebras and TSMC team up to create this mammoth...
  6. Daniel Payne

    ISQED'20 - Call for Contributions, deadline September 14

    21st ISQED - March 25-26, 2020 - Santa Clara Convention Center, California About the Conference A pioneer and leading interdisciplinary conference, the 21st International Symposium on Quality Electronic Design (ISQED2020) accepts and promotes original and unpublished papers related to the topics...
  7. Daniel Payne

    Feedback welcome for our latest paper on the China 2025 IC plan

    For figure one, what are the blue and red lines?
  8. Daniel Payne

    Smart Phone Medical Emergency Icon Now

    Arthur, There's an entire industry already formed around "medical alerts", here are the top 10 devices, https://www.consumersadvocate.org/medical-alerts/a/best-medical-alerts Many seniors are phone-phobic, so getting them to actually use a smart phone is a barrier...
  9. Daniel Payne

    What Happened to RSS feeds?

    The SemiWiki.com changed platforms recently, so try this address for your feed https://semiwiki.com/feed/ and the RSS for Forum discussions is https://semiwiki.com/forum/index.php?forums/-/index.rss
  10. Daniel Payne

    AI Plays Poker, Design Chips?

    Arthur, I listened to a radio episode talking about that poker-playing AI system this week, but remember that AI today is totally domain-specific, meaning that there is NO general purpose AI out there. Yes, AI and specifically Machine Learning is used in many places of EDA tools, just click the...
  11. Daniel Payne

    ISQED 2020 - Call for papers

    21st ISQED - March 2020, Santa Clara Convention Center, California Submission Deadline: Sept. 14th, 2019 About the Conference A pioneer and leading interdisciplinary conference, the 21st International Symposium on Quality Electronic Design (ISQED2020) accepts and promotes original and...
  12. Daniel Payne

    DVCon U.S. 2020 Announces Call for Extended Abstracts, Panels, Tutorials and Short Workshop Proposals

    Submission site for extended abstracts is open; other submission sites to open August 6, 2019 Louisville, CO—July 9, 2019 —The 2020 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended...
  13. Daniel Payne

    Along came a trojan? GDSII vs Silicon check

    Great question, and at least DARPA has been looking at securing the IC parts supply chain. https://gcn.com/articles/2019/01/14/darpa-supply-chain-security.aspx
  14. Daniel Payne

    Asia South Pacific DAC - Call for papers

    Call for Papers ASP-DAC 2020 http://www.aspdac.com January 13-16, 2020 China National Convention Center (CNCC), Beijing, China Aims of the Conference: ASP-DAC 2020 is the 25th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most...
  15. Daniel Payne

    ISQED 2020 - Call for Papers

    Call for Papers 21st ISQED - March 2020, Santa Clara Convention Center, California Submission Deadline: Sept. 14th, 2019 About the Conference A pioneer and leading interdisciplinary conference, the 21st International Symposium on Quality Electronic Design (ISQED2020) accepts and promotes...
  16. Daniel Payne

    ARM Suspends Business With Huawei Just As EE Removes Huawei Phones From 5G launch

    It's just a matter of time before the Chinese government starts to add US Vendors to their own blacklist as a form of retaliation. Back in 2016 my youngest son purchased a Chinese smartwatch on eBay, only to discover that it was sending all of his phone contacts to China, quite the privacy...
  17. Daniel Payne

    DAC 2019 - Marie Pistilli Award Recipient

    R. Iris Bahar to Receive Marie R. Pistilli Women in Engineering Achievement Award Brown University professor honored for outstanding technical contributions in energy efficient and reliable electronic systems, nanoelectronics, and nanotechnology LOUISVILLE, Colo. – April 24, 2019 –– Iris...
  18. Daniel Payne

    DVCon Europe 2019 to be held on 29th and 30th October in Munich

    Scope broadened to include embedded software. Calls for papers, tutorials and panels issued. Munich, Germany – March 21st, 2019 - The Design and Verification Conference & Exhibition Europe (DVCon Europe), sponsored by Accellera Systems Initiative, has announced the call for papers, tutorials...
  19. Daniel Payne

    2nd MOS-AK India Conference, Feb 25-27, 2019 - Summary

    2019 IEEE International Conference on Modeling of Systems Circuits and Devices Organised by Joint Chapter of CAS /ED Societies, IEEE Hyderabad Section 2nd MOS-AK India Conference (IEEE Conference #45395) Venue: IIT Hyderabad February 25-27, 2019 The MOS-AK Compact Modeling Association, a...
  20. Daniel Payne

    LSCC - stock jumps on Q4 sales and revenue guidance

    Lattice Semi a turnaround story? Shares at highest point in 15 years - oregonlive.com Lattice is the third, but smaller competitor to Xilinx and Intel in the FPGA market.
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