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Search results

  1. F

    Intel secures high-NA EUV kits over rivals

    Customers would be sharing the use of the ASML-imec High-NA Lab for resist/underlayer testing: https://www.spiedigitallibrary.org/conference-proceedings-of-spie/12953/129530P/The-next-step-in-Moores-law--high-NA-EUV/10.1117/12.3009070.full#_=_
  2. F

    Intel secures high-NA EUV kits over rivals

    EUV resist issues should hit pretty soon.
  3. F

    With new technologies will Crossbar phase change memory become viable?

    I think a 4F^2 DRAM is more likely than a crossbar new memory type. It is the same form factor, but much easier to design for, as well as cheaper.
  4. F

    Intel secures high-NA EUV kits over rivals

    TheElec is sometimes enthusiastically pro-Korean, so in mentioning only Samsung and SKHynix, author didn't realize SKHynix was not foundry. 10nm (1d) will have unavoidable substantial multipatterning, so 3D-DRAM is actively being developed today. I have already heard quite a few proposals at IMW...
  5. F

    Intel secures high-NA EUV kits over rivals

    Is Intel 7 still running with SAQP? I read that Intel 4 also continued use of SAPQ for tightest pitch. Interesting also that they didn't buy many more of the NXE systems instead, perhaps they couldn't and the first few EXE shipments was the result?
  6. F

    Intel secures high-NA EUV kits over rivals

    Not surprisingly, this kind of article got the technical statements all wrong. In fact, collected light is lost through the obscuration (hole in mirror). The NA is about focusing light in space but in an EUV resist, there are electrons spread, so the connection between NA and resolution is...
  7. F

    Qualcomm confirms Huawei no longer needs its chips

    https://www.gizchina.com/2024/05/11/huawei-no-longer-needs-qualcomm-chips/ EFE UDIN MAY 11, 2024 Qualcomm, a leading American semiconductor company, has recently confirmed that Huawei, a Chinese telecommunications giant, no longer requires its processors. This announcement comes amidst ongoing...
  8. F

    Huawei Pura 70 smartphone sales start; chip still a mystery

    https://zh.ifixit.com/Guide/Pura+70+Pro+Chip+ID/172264
  9. F

    TSMC statement on next-generation EUV

    Intel 4 removed cobalt, so that implies the problem. Maybe they're stuck with the cobalt for Intel 7 (?), that would be unfortunate.
  10. F

    TSMC statement on next-generation EUV

    It's a big rebuild for the High-NA system, so their current EXE would be a wasted evaluation. Maybe they are seeing the productivity pitfalls of mixing with conventional field systems. It's possible they are still anticipating some large GPU die not just processor chiplets.
  11. F

    Government-backed Japan Investment Corporation (JIC) completes takeover of JSR

    https://www.j-ic.co.jp/en/news/.assets/E_20240417_JIC_JICC_PressRelease.pdf Government-backed Japan Investment Corporation (JIC) completed takeover of Japanese photoresist manufacturer JSR, which previously acquired Inpria, the maker of metal oxide photoresists. There are ongoing lawsuits...
  12. F

    TSMC statement on next-generation EUV

    There were some hints the decision by Intel to pursue High-NA was made without thinking everything through. The clearest evidence is their sudden push for a larger (2X) mask size, supposedly driven by cost.
  13. F

    TSMC statement on next-generation EUV

    Maybe Intel just gave away their power is not so high, possibly a pellicle limitation.
  14. F

    TSMC statement on next-generation EUV

    Right now a bigger problem than High-NA is the EUV resist, a little surprised that was not explicitly mentioned in the TSMC report: (from ASML's HNA print)
  15. F

    Huawei Pura 70 smartphone sales start; chip still a mystery

    CXMT can offer 12 GB but there are 16 GB models of Pura 70 (Ultra or Pro+), so those should be supplied by Korean manufacturers.
  16. F

    TSMC statement on next-generation EUV

    It looks like A14 development is not hinging on High-NA either: "TSMC started development and made good progress on 14 Angstrom (A14) technology, which aims to further improve speed, power, density and cost," the company's Annual Report reads. "Looking ahead to A14 and beyond, TSMC R&D will...
  17. F

    Samsung Electronics Announces First Quarter 2024 Results

    For TLDR needs: The Memory Business returned to profit as it achieved qualitative growth by addressing the demand across servers, storage, PC and mobile, focusing on high-value-added products such as HBM, DDR5, server SSDs and UFS 4.0., along with the increase in ASP. The Foundry Business...
  18. F

    Samsung Electronics Announces First Quarter 2024 Results

    https://news.samsung.com/global/samsung-electronics-announces-first-quarter-2024-results Samsung Electronics today reported financial results for the first quarter ended March 31, 2024. The Company posted KRW 71.92 trillion in consolidated revenue on the back of strong sales of flagship Galaxy...
  19. F

    TSMC statement on next-generation EUV

    https://www.tomshardware.com/tech-industry/tsmc-says-it-doesnt-need-high-na-chipmaking-tools-for-16nm-class-node-in-contrast-intel-has-championed-the-tech TSMC says its newest process tech doesn't need ASML's High-NA EUV chipmaking tools that have been championed by Intel, but the foundry is...
  20. F

    Video: Intel Adds ASML’s First High NA EUV Tool to Oregon Factory

    More thinking should be on the EUV resist than the High-NA or other optics.
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