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Met him in a few occasions, a really impressive scientist with an exceptional clarity of view. His book on litho is a must for anyone wanting a deep understanding.
When you decide at government level that you do not want to depend for some critical components from TSMC, than the Japanese way, even if a nearly impossible one, is the only one. And I would not completely discount Koike-san and Higashi-san capabilities in driving this venture. Is not like they...
You cannot tell from those curves, You need the Id vs Vg at the right Vds. And a 2.5x value on a log scale can be difficult to see. Consider that they claim an improvement in SS so that helps lowering the Ioff at a given Vdd.
Semantics. Look at the quote, they state "at same drive current" so the Ioff that has a 5x improvement is not the one at same VDD but the one at at the VDD that gives the same Ion as Intel 4. Vg should be 0 in all cases as that is the voltage at which is the gate of the transistor leaking in an...
You can find good info on water management by TSMC in their sustainability report
https://esg.tsmc.com/en-US/file/public/e-r3-aPractitionerOfGreenPower_2.pdf
Plenty of uses for graphene, but for it and for any material one considers for computing purposes (unless you go back to Shannon/Turing/.... and start anew) you need something to make a good switch and for that purpose graphene is pretty lousy. Mobility is important but can be useless if you do...
This is a follow-up to the project already partially funded by EU (292M€ on a total of 730M€) to make a production plant for SiC substrates. If they did put any of those two outside Italy, the CEO would have had to give serious explanations to the Italian Government that still own a large...
Right. And please look at the date of J.P. publication by IanD. I remember seeing his presentation at IEDM 1990 where GAA was already there and some of his early 2000s papers on advantages and disadvantages of various device structures. Unfortunately marketing took over ;)
Issues with 2D...
Polar is a specialty fab specialised in high voltage, high temperature and rad hard components. About 250Kwafer 200mm per year. The type of components some major defense players want to make sure they have access to.
That the balance of outsourcing to a supplier that has lower cost of production is always positive is debatable. You have to add the cost of keeping your internal lines operating at a lower loading, as you cannot easily adapt your overall capacity and cancel fixed costs. In practice, unless you...
Doubt that it is always the case, otherwise EUV would not sell. For some layers it is clearly an economic advantage somehow.
Excellent point. That was the oversimplification that fails the moment we deals with stochasticity. At that point we move from classical to quantum optics and the...
Agreed, but definitely the number and cost of overall processing steps went down with EUV introduction at 7 and 5nm. Will that still be true is part of the question I think. Not so much into litho as at one time, but I think that the debate, for those that can have access to EUV, will be...
As for any other process, is not a matter of "best technology" but of "what does it well enough at the right cost". Then the issues are "well enough" and "right cost" that may differ among players. EUV certainly does it well enough (even "better" arguably) and cheaper than multi-patterning at 7...
Bias can be in the programming and can be in the training data set. The problem is exacerbated in Gen AI as it uses vastly larger and diffentiated datasets than those used in machine learning, and so are even more difficult to sceen and control. That is why they put some hard rules on the...
There was actually only one 157nm tool I remember delivered: the ASML/SVG/PE Micrascan to imec. In the meantime ASML was working on the immersion 193 prototype and, as soon as the first images printed with it came out, 157nm was dead. Intel invested a lot in programs in 157nm over the years and...
157nm, good all times. Intel declaring at SPIE the needs of tons of CaF2 crystals for the hundreds of steppers they were going to buy just 3 weeks before ditching everything. Schott ever so glad of keeping with the plan of waiting until the first full demonstration of the stepper before boosting...
Competing agains NVidia on AI now is like competing with Xilinx in the past for FPGA. So much is tied in the software that either you are fully compatible or you do not get market share for your hardware. So you are always at a disadvantage.
A patent is worth only how much you are ready to spend to enforce it.
Is AMAT going to sue any of their customers using it without paying licenses ? I doubt it.
And ASML is not going to loose any business over this I think, as it applies only to a restricted set of patterns.
Seen from this side of the pond the TSMC fabs in US and Japan are quite different and not comparable proposition. In US the claim is for an advanced fab fully TSMC for 5nm and below with a tinge of "national interest". In Japan it is a joint venture with local co-investors (mostly customers) for...