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Intel and TSMC IDM 2024 Discussions

Intel and TSMC IDM 2024 Discussions
by Mark Webb on 03-10-2024 at 8:00 am

TSMC Intel

In December 2023, we published the Intel Revenue forecast for external wafer sales, gave a breakdown on how customers plan to ramp the foundry. The forecast is still valid (it assumes Intel executes on all plans) but since then we have a better understanding of Intel’s strategy and scenarios that could unfold.

The scenarios… Read More


Intel Direct Connect Event

Intel Direct Connect Event
by Scotten Jones on 02-23-2024 at 12:00 pm

Figure 1

On Wednesday, February 21st Intel held their first Foundry Direct Connect event. The event had both public and NDA sessions, and I was in both. In this article I will summarize what I learned (that is not covered by NDA) about Intel’s business, process, and wafer fab plans (my focus is process technology and wafer fabs).

Business
Read More

ISS 2024 – Logic 2034 – Technology, Economics, and Sustainability

ISS 2024 – Logic 2034 – Technology, Economics, and Sustainability
by Scotten Jones on 02-19-2024 at 8:00 am

Slide4

For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in ten years from a technology, economics, and sustainability perspective. The following is a discussion of my presentation.

To understand logic, I believe it is useful to understand what makes… Read More


Intel should be the Free World’s Plan A Not Plan B, and we need the US Government to step in

Intel should be the Free World’s Plan A Not Plan B, and we need the US Government to step in
by Chris Krueger on 02-19-2024 at 6:00 am

TSMC Intel

There are trillions of dollars at stake with AI and huge geopolitical consequences. However, the weak foundation to American technological power is their dependence on Taiwan and TSMC, which is where most advanced silicon is manufactured. America has also been taking China to the ropes lately in their economic/technology proxy… Read More


How Disruptive will Chiplets be for Intel and TSMC?

How Disruptive will Chiplets be for Intel and TSMC?
by Daniel Nenni on 01-15-2024 at 10:00 am

UCIe Consortium

Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More


IEDM: What Comes After Silicon?

IEDM: What Comes After Silicon?
by Paul McLellan on 01-09-2024 at 10:00 am

Screen Shot 2024 01 05 at 8.50.58 AM

The annual International Electron Devices Meeting (IEDM) took place last month. One of the presentations on the short course was by Matthew Metz of Intel titled New Materials Systems for Moore’s Law Continuation. In essence this was a look at some of the possibilities for what comes after silicon runs out of steam.

Matthew started… Read More


2024 Big Race is TSMC N2 and Intel 18A

2024 Big Race is TSMC N2 and Intel 18A
by Daniel Nenni on 01-01-2024 at 6:00 am

Intel PowerVia backside power delivery

There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.

From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More


IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation
by Mike Gianfagna on 12-10-2023 at 2:00 pm

IEDM Buzz – Intel Previews New Vertical Transistor Scaling Innovation

For more than 65 years, the IEEE International Electron Devices Meeting (IEDM) has been the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. As I post this, the conference is underway in San Francisco… Read More


Predicting Stochastic Defectivity from Intel’s EUV Resist Electron Scattering Model

Predicting Stochastic Defectivity from Intel’s EUV Resist Electron Scattering Model
by Fred Chen on 11-22-2023 at 6:00 am

Predicting Stochastic Defectivity from Intel's EUV Resist Electron Scattering Model

The release and scattering of photoelectrons and secondary electrons in EUV resists has often been glossed over in most studies in EUV lithography, despite being a fundamental factor in the image formation. Fortunately, Intel has provided us with a laboriously simulated electron release and scattering model, using the GEANT4… Read More


Arm Total Design Hints at Accelerating Multi-Die Activity

Arm Total Design Hints at Accelerating Multi-Die Activity
by Bernard Murphy on 11-02-2023 at 6:00 am

multi die

I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More