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    by Published on 01-16-2017 11:00 AM
    1. Categories:
    2. Intel,
    3. IoT Internet of Things
    Article: 4 Billion CEVA powered Chips shipped (to be noticed: chips, not cores)-compute-card-devices-min-jpg

    Intel is once again adding a new computing form factor to the mix. At CES Intel announced its new Intel Compute Card. It combines CPU, GPU, DRAM, storage, WiFi, and communications inside a small modular housing slightly larger than a credit card and about 5mm thick. Intel already offers its Compute ...
    by Published on 01-16-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. FPGA,
    4. S2C
    Article: 2nd International RRAM Workshop at Stanford-s2c-fpga-prototyping-jpg

    I haven’t sat down to speak with S2C since we collaborated on the book, PROTOTYPICAL, published just before DAC 2016 and even then, I hadn’t spoken to Toshio Nakama, their CEO. Toshio splits his time between the San Jose headquarters and the Shanghai headquarters so getting time to meet ...
    by Published on 01-15-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. FD-SOI,
    4. FinFET
    Article: Tensilica Ships 2 Billionth Core-mos-ak-jpg

    The world-renowned statistician, Professor George Box, said, "Essentially, all models are wrong, but some are useful." -- that quote was the theme for one of the technical talks at the recent MOS-AK Workshop, held at UC-Berkeley.


    ...
    by Published on 01-13-2017 11:00 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. TSMC
    Article: CDNLive Call For Papers-morris-chang-tsmc-jpg

    First, the TSMC Museum of Innovation is now open and it’s quite impressive. Located right below Fab 12, it is definitely worth an hour of your time. Second, Morris Chang was on the investor call which made it much more interesting, especially his comments on the recent ...
    by Published on 01-13-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Cadence,
    4. Mobile,
    5. IoT Internet of Things
    Article: 4 Billion CEVA powered Chips shipped (to be noticed: chips, not cores)-home-automation-min-jpg

    Bluetooth has been very successful for many years, but arguably trapped in a niche, at least for us consumers, as a short-range wireless alternative to a wire connection – to connect your phone to a car or speakers for example. (In fairness I should add that the 4.2 version has improved ...
    by Published on 01-12-2017 11:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. ARM,
    4. TSMC,
    5. FinFET
    EDACafe Mistakes Cadence Inc for Cadence Design Systems-finfet-cross-section-jpg

    If you click FinFET in the SemiWiki.com Latest News: navigation bar at the top of this page you will get a list of 86 blogs that have been viewed more than 600,000 times. If you go to the last blogs on the list, meaning the first blogs to be published, you will see a three part series, “Introduction to FinFET Technology” written by Tom Dillinger ...
    by Published on 01-12-2017 06:00 AM
    1. Categories:
    2. Security
    Article Preview

    Just how reliant are we on computing infrastructure? Sometimes it takes just a little outage to get a taste of the interwoven dependency we don’t readily see.

    It can be small. The international travelers landing in U.S. airports on January 3rd, one of the busiest travel days of the year, found themselves stuck in long lines due to a temporary ...
    by Published on 01-11-2017 11:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. MunEDA
    Article: DAC: It's the Last Week for Many Submissions-bandgap-reference-min-jpg

    Talking with actual IC designers is always fascinating to me, because these engineers are the unsung heroes that enable our modern day world of consumer and industrial electronics. Too often we only hear from the CEO or other C-level executives in the press about their own companies, products, services and vision. I recently had the pleasure to interact with Josh Yang, Director of the SMIC IP R&D Center about one specific ...
    by Published on 01-11-2017 06:00 AM
    EDACafe Mistakes Cadence Inc for Cadence Design Systems-piloted-auto-jpg

    Last week I wrote about NetSpeed’s network on chip (NoC) IP technology and design environment NocStudio. This week we see a real life application of this technology announced at CES by Imagination Technologies and NetSpeed. The companies have announced ...
    by Published on 01-11-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Cliosoft,
    4. Automotive
    Article: TSMC OIP Forum 2012 Trip Report!-car-sensors-min-jpg

    Archaeologists often use tools found in digs as a major indicator of trends in civilizations. The same could be said for trends in design, though we don’t have to reconstruct these design trends – we tend to see them ahead of us.
    The trend ...

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