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That is a valid way to look at it but that view will not get extra funding for Gina.
I believe 70% is China and Taiwan, China's claimed rogue province (the joke).
Just look at the budget of the US Commerce Dept since Gina Riamondo arrived. She is building a kingdom. This was a fund raising speech, absolutely. Do you really think the US will catch up to China? I'm talking about total capacity not just leading edge.
'US official says Chinese seizure of TSMC in Taiwan would be 'absolutely devastating'
Understatement of the year. If TSMC is seized by China it will cease to exist. There was a strategy paper published by the US Military suggesting that if China attacked Taiwan that a coalition could strike the...
Illustration shows Intel logo
(Reuters) -Intel said its sales would take a hit on Wednesday after the U.S. revoked some of the chipmaker's export licenses for China, in a move Beijing complained was going too far in the name of national security.
Intel did not disclose the name of the Chinese...
From what I can remember through my 40 years, semiconductor cost is key. If what TSMC says is true, that it costs more make wafers in the US, that is going to be a problem when we have over supply. Remember, China has gone down to 5nm without EUV. China is also buying up semiconductor equipment...
U.S. forecast to increase its domestic chip manufacturing by 203% in the decade following enactment of the CHIPS and Science Act—and expand its share of the world’s total fab capacity for the first time in decades—according to new Semiconductor Industry Association/Boston Consulting Group report...
It is for internal use. Apple is a very large cloud company. It is also an ego thing amongst the cloud companies. Amazon has been at a lot of conferences lately bragging. Seriously, I have seen several keynotes from them this year and more to come. It's the Annapurna Labs people they bought in...
I use my iPad Pro daily, it is a great device. I buy a new one when the battery doesn't hold a charge (3-4 years). I have never thought to get one for speed or any "new" feature.
M4 enables the breakthrough design and stunning display of the new iPad Pro, while delivering a giant leap in performance
M4 is a system on a chip (SoC) that advances the industry-leading power-efficient performance of Apple silicon.
CUPERTINO, CALIFORNIA Apple today announced M4, the latest...
(Reuters) - Apple is developing its own chip to run artificial intelligence software in data centers, the Wall Street Journal reported on Monday, citing people familiar with the matter.
The project, internally codenamed as Project ACDC (Apple Chips in Data Center), aims to leverage Apple's chip...
Certainly good news. Globalfoundries also posted a good quarter:
Key First Quarter Financial Highlights
-Revenue of $1.549 billion
-Gross margin of 25.4% and Non-IFRS gross margin(1) of 26.1%
-Operating margin of 9.5% and Non-IFRS operating margin(1) of 12.1%
-Net income of $134 million and...
TAIPEI, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), today reported unaudited net sales for the month of April 2024.
(*) All figures in thousands of New Taiwan Dollars (NT$), except for percentages.
(**) All figures are consolidated
Additional...
Good question. I think this is a future consideration since TSMC is very clear that they do not do it as of today. Once CoWos capacity opens up TSMC may allow it rather than have idle factories.
The good news is that ramping a packaging facility takes much less time and much less money than building a fab so this is a very temporary bottleneck. So many surprises in the semiconductor industry.
I have asked TSMC on several occasions if they will package non TSMC logic die with TSMC die and they have said no. Same thing for chiplets. It is a hard stance since Intel will accept other foundry die and are packaging Intel and TSMC die already but I understand since they are currently...
TSMC, the world’s leading semiconductor manufacturer, has announced that its advanced packaging capacity is fully booked for the next two years. This development comes as Nvidia, AMD, and Guanghuida secure TSMC’s cutting-edge packaging technologies for their high-performance computing (HPC)...
Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) seeking proposals from eligible applicants for activities to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. Digital twins are virtual models...
