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    by Published on 07-23-2014 02:30 PM
    1. Categories:
    2. General
    content/attachments/11629-google-glass-banned.jpg

    Not a total fail but I would classify it as a Segway type fail meaning that while society on a whole will shun Google Glass there will be a number of ...
    by Published on 07-23-2014 07:50 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. Intel
    content/attachments/11619-ims.jpg

    There are some interesting parallels between Intel and Microsoft. Both of them missed mobile. Actually they didn't completely miss mobile, both of them had programs from early days. But clearly they both regarded mobile as a much lower priority: the PC was where all the money ...
    by Published on 07-23-2014 05:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. Arteris
    content/attachments/11626-dvfs-concept.jpg

    Most of the buzz on network-on-chip is around simplifying and scaling interconnect, especially in multicore SoCs where AMBA buses and crossbars run into issues as more and more cores enter a design. Designers may want to explore how NoCs can help with a more power-aware approach. ...
    by Published on 07-22-2014 09:59 PM
    1. Categories:
    2. FPGA,
    3. Xilinx
    content/attachments/11630-xilinxlogo.jpg

    Xilinx announced their results today and had their conference call this afternoon, which I listened to. For them this is 1Q fiscal 2015 which means you have to be careful since there is a big difference between talking about fiscal quarters and calendar quarters. Xilinx's conference ...
    by Published on 07-22-2014 05:00 PM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. GlobalFoundries,
    4. Intel,
    5. TSMC
    content/attachments/11621-semiconductor-manufacturing.jpg

    There have been a lot of interesting announcements and presentations lately from the leading edge foundries. Looking at all of this information, a pretty interesting picture begins to emerge.

    TSMC
    TSMC is far and away the world’s largest foundry. In their 2014-Q2 conference call TSMC outlined their expectations for the balance of 2014 out through 2015.

    At 28nm TSMC has LP (low power), ...
    by Published on 07-22-2014 11:30 AM
    1. Categories:
    2. Semiconductor Services,
    3. SEMI,
    4. Semiconductor Intelligence
    content/attachments/11625-gartner-jul14.jpg

    At SEMICON West two weeks ago, Bob Johnson of Gartner presented the outlook for the semiconductor market, semiconductor capital spending, and wafer fab equipment spending. Thanks to ...
    by Published on 07-22-2014 05:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. Sonics
    content/attachments/11603-sonicsmem1.jpg

    There is never enough memory bandwidth. Well, occasionally there is but many SoCs have lots of blocks that communicate through memory, typically off-chip DRAM. In 2001 Sonics created their first solution to this problem with MemMax technology that was incorporated into their SonicsSX ...
    by Published on 07-21-2014 08:00 PM
    1. Categories:
    2. Semiconductor Design,
    3. Cadence
    content/attachments/11623-cadencelogo.jpg

    Cadence announced their 2Q results this afternoon. I listened to the conference call.

    You can read all the details of the results in the press release but the big picture is:
    • Revenue $379K, net income $23M GAAP or $64M non-GAAP (8, 21c per share, beat estimates
    ...
    by Published on 07-21-2014 04:00 PM
    1. Categories:
    2. Semiconductor Design,
    3. Semiconductor Manufacturers
    content/attachments/11608-amd-ati-logo.jpg

    While listening to the Intel and AMD conference calls last week I was reminded of the ATI acquisition by AMD and the painfully long cultural assimilation that ensued. The title of this blog could just ...
    by Published on 07-21-2014 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Blendics
    content/attachments/11611-blendics.jpg

    The reliability metric, Mean Time Between Failures (MTBF), is often misunderstood. Use of an MTBF metric generally assumes a random failure process, one that is very infrequent and has no memory of past failures. Such failure modes can occur in System-on-Chip (SoC) designs and ...

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