Today TSMC announced a new technology in 22nm ULP which is actually a shrink of the 28nm HKMG technology.
Overall the technology is offer 15% improvement, 35% power reduction and 10% area benefits over 28HPC+ for the same mask count, Sram bit cell etc... and Vmin is 0.6V.
on different slides the technology is compared to 22FDSOI (GF) and the perf matches exactly between the 2 technologies.
the technology is said to be key for the 5G deployement, being the densest technology with good RF and mmW behavior ( Finfet loosing in high frequency vs planar). Ft is expected to superior to 400Ghz. it is also expected to allow integration of the RF FEM in GaAs in the CMOS SoC ( beamforming application with a HVMOS running at 150Ghz.
In my opinion it is a direction reaction to the 22FDSOI technology from GF, similar to what happened with the 12FFC announced last year to fight 12FDSOI from GF.
as you can see on the slide, TSMC did 800 Taped-outs in 2016 in 28nm nodes, and shipped more than 4.5M wafers in this technology ( not sure if this is during 2016 or since the beginning). Very impressive TSMC !!