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Thread: TSMC kicks off record $24bn advanced chip project

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    Admin Daniel Nenni's Avatar
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    TSMC kicks off record $24bn advanced chip project

    TSMC kicks off a $24B advanced chip project to fend off rival Samsung.

    • Ground was broken today on the $17.2B 5nm advanced chip facility in southern Taiwan at an estimated cost of $24B
    • The record chip project should push TSMC to 5% to 10% growth in the coming years, according chairman Morris Chang
    • TSMC leads the global foundry market with 56% market share versus Samsung 8%

    "The latest chip project is set to go into test pilot runs in 2019 and to churn out the world's most leading-edge 5-nanometer chips by 2020 ... We are also confident to roll out 3-nanometer chips some four years from now," says TSMC Chang.

    https://asia.nikkei.com/Business/AC/...project?page=1

    TSMC kicks off record bn advanced chip project-tsmc-tainan-plant-kick-off-morris-chang_article_main_image.jpg

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    Last edited by Daniel Nenni; 01-26-2018 at 04:20 PM.
    Now available in print or Kindle: "Mobile Unleashed: The Origin and Evolution of ARM Processors In Our Devices"

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    More details from TSMC website:
    Fab 18 will be in 3 phases, which collectively will reach 83K per month. This is TSMC's fourth Gigafab.
    5nm production in 2020 after equipment move-in in 2019.

    My thoughts:
    Samsung S3 will be the first EUV foundry fab, but as expected TSMC is not far behind. EUV requires a new, purpose-built generation of fabs, which brings a vertiginous high investment cost. Samsung and TSMC are both investing very heavily in EUV fabs while Intel and Global Foundries have not yet made any similar announcements, perhaps laying the foundation for a duopoly.

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    Admin Daniel Nenni's Avatar
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    Quote Originally Posted by benb View Post
    More details from TSMC website:
    Fab 18 will be in 3 phases, which collectively will reach 83K per month. This is TSMC's fourth Gigafab.
    5nm production in 2020 after equipment move-in in 2019.

    My thoughts:
    Samsung S3 will be the first EUV foundry fab, but as expected TSMC is not far behind. EUV requires a new, purpose-built generation of fabs, which brings a vertiginous high investment cost. Samsung and TSMC are both investing very heavily in EUV fabs while Intel and Global Foundries have not yet made any similar announcements, perhaps laying the foundation for a duopoly.
    Nope. TSMC will introduce EUV first. Customers have mentioned getting EUV at the contacts and vias at 7N before getting EUV for metals and shrink at 7N+. Samsung may have more EUV layers but TSMC will be first, absolutely. I will know more next week when I am in Hsinchu so stay tuned.

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    Blogger Scotten Jones's Avatar
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    Quote Originally Posted by benb View Post
    More details from TSMC website:
    Fab 18 will be in 3 phases, which collectively will reach 83K per month. This is TSMC's fourth Gigafab.
    5nm production in 2020 after equipment move-in in 2019.

    My thoughts:
    Samsung S3 will be the first EUV foundry fab, but as expected TSMC is not far behind. EUV requires a new, purpose-built generation of fabs, which brings a vertiginous high investment cost. Samsung and TSMC are both investing very heavily in EUV fabs while Intel and Global Foundries have not yet made any similar announcements, perhaps laying the foundation for a duopoly.
    Both Intel and GF have EUV systems. GF has 2 being installed in Fab 8 now and 2 more due next year. Intel is rumored to have 8 EUV tools in Oregon presumably in D1X.

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    The trial or risk production for 5nm is supposed to be mid-2019.

    Taiwan Semiconductor Manufacturing Company Limited

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