Both Micron and TSMC/Partners it seems have been working at actually mixing processor and memory together or at least integrating them in new ways towards maximizing the functionality. Micron has been working on the Automata computing using 3DxPoint that mixes both and TSMC using Crossbar and InFo packaging that also mixes computing power and memory. Micron has spun out the Automata process to Natural Intelligence based also in Boise, but I can't find out who owns it. Are we looking at a stealth race to change the future of computing and memory? Any comments, thoughts or ideas on this topic would be appreciated.

Advanced packaging: five trends to watch in 2017 - Electronic Products