The die sizes of Intels new Skylake-X and Xeon CPUS have been estimated on Anandtech:
10-core LCC: 308mm2
18-core HCC: 473mm2
28-core XCC: 677mm
AMD has only one die (Zeppelin) which is 194 mm2 and they combine it in an MCM.
The MCM packages is 2 die's for Threadripper and 4 dies for Epyc.
My question is which is cheaper to manufacture (assuming GloFlo's 14nm is equally mature as Intel's 14nm+)?
I think larger dies are going to have lower yields, but also maybe packaging for MCM is more expensive?
Any of the experts here like to have a guess?