Modeling of Systems and Parameter Extraction Working Group
Spring'18 MOS-AK Workshop
Munich, March 13, 2018



The MOS-AK Compact Modeling Association, a global compact/SPICE modeling and Verilog-A standardization forum, held its Spring compact/SPICE workshop in Munich. The event was hosted on March 13, 2018, by Infineon Technologies AG in Neubiberg. The technical program of the event was coordination by Klaus-Willi Pieper, Infineon, and the MOS-AK TPC Committee. The workshop has received full industrial sponsorship by Infineon Technologies AG (lead sponsor) with technical program promotion provided by ASCENT Network, Keysight Technologies, IJHSES as well as NEEDS of nanoHUB.org


The MOS-AK workshop was opened by Klaus-Willi Pieper, Principal Compact Modeling Smart Power Devices at Infineon, who has welcomed all the attendees and shared Infineon view on the compact modeling and its importance in the TCAD/EDA modeling/design ecosystem.


A group of 40+ international academic researchers and modeling engineers attended 10 technical compact modeling presentations covering full development chain from the nanoscaled technologies thru semiconductor devices modeling to advanced IC design support. The MOS-AK speakers have shared their latest perspectives on compact/SPICE modeling and Verilog-A standardization in the dynamically evolving semiconductor industry and academic R&D. The event featured advanced technical presentations covering compact model development, implementation, deployment and standardization covering full engineering R&D chain: TCAD/processing, device modeling, transistor level IC design support. These contributions were delivered by leading academic and industrial experts, including: [1] Klaus-Willi Pieper, Overview of the Compact Modeling at Infineon; [2] James Ma et al, Advanced Fast on-wafer Low-frequency Noise Measurement with High Resolution, Wide Bandwidth and Large Biasing Current Range; [3] Volker Gloeckel, Advances in Statistical Compact Modeling; [4] Markus Becherer, et al, Compact Modeling of Nanomagnetic Logic Devices and Circuits; [5] Gražvydas Žiemys, Devices for Nanomagnetic Logic; [6] Paul Roseingrave, Modelling Emerging Devices through EU ASCENT Network; [7] Jushan Xie, How Is CMC Standard Model Implemented and Verified In Simulator?; [8] Maria Cotorogea et al, Virtual Prototyping for Power Diode and IGBT Development; [9] Franz Sischka, et al, Modeling of Device Aging - Example: Diode; [10] Katja Puschkarsky, Device Aging Simulations Enabling Circuit Optimizations; [11] Fabio A. Velarde Gonzalez, Integration of Aging Models Across Different EDA Environments A case study implementing HCI and NBTI models for X-FAB XU035 CMOS technology; During complementary MOS-AK Panel Discussion on Compact Model Licensing Peter Lee, CMC Chair highlighted current status of the CMC compact model licensing status, stating that final discussions are converging to establish official licensing in the next few months. All the presentations are available online for download at <http://www.mos-ak.org/munich_2018/>. Selected best presentation will be recommended for further publication in the IJHSES.


The MOS-AK, international compact modeling association, has various deliverables and initiatives including a book entitled "Open Source TCAD/EDA Tools for Compact Modeling" and open Verilog-A model directory with supporting FOSS TCAD/EDA tools. The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and courses in Europe, USA, China and India throughout coming 2018/2019 years, including:






About MOS-AK Association:

MOS-AK, an international compact modeling association primarily focused in Europe, to enable international compact modeling R&D exchange in the North/Latin Americas, EMEA and Asia/Pacific Regions. The MOS-AK Modeling Working Group plays a central role in developing a common information exchange system among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact/SPICE modeling and its Verilog-A standardization and related CAD/EDA tools including FOSS for the compact/SPICE models development, validation/implementation and distribution. For more information please visit: mos-ak.org


About Infineon Technologies AG:
Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive electronics, industrial electronics, RF applications, mobile devices and hardware-based security. Combining entrepreneurial success with responsible action, at Infineon we make the world easier, safer and greener. Barely visible, semiconductors have become an indispensable part of our daily lives. Infineon’s components play an essential role wherever electric energy is generated, transmitted and used efficiently. Furthermore, they safeguard data communication, improve safety on roads and reduce automotive emissions. Product range includes:

  • Automotive: 32-bit automotive microcontrollers for powertrain, safety and driver assistance systems, discrete power semiconductors, IGBT modules, industrial microcontrollers, magnetic and pressure sensors, power ICs, radar sensor ICs (77 GHz), transceivers (CAN, LIN, Ethernet, FlexRay), voltage regulators
  • Industrial Power Control: bare die business, discrete IGBTs, driver ICs, IGBT modules (low-power, medium-power, high-power), IGBT module solutions incl. IGBT stacks, silicon carbide modules
  • Power Management & Multimarket: control ICs, customized chips (ASICs), discrete low-voltage and high-voltage power MOSFETs, gallium nitride (GaN) transistors, GPS low-noise amplifiers, low-voltage and high-voltage driver ICs, MEMS and ASICs for silicon microphones, pressure sensors, radar sensor ICs (24 GHz, 60 GHz), RF antenna switches, TVS (transient voltage suppressor) diodes
  • Chip Card & Security: contact-based security controllers, contactless security controllers, dual-interface security controllers (contact-based and contactless), embedded security controllers


Presence: 36 research and development locations, 18 manufacturing locations and about 44 sales offices worldwide