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  • Semiconductor Experts RSS Feed

    by Published on 10-20-2017 10:00 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. GlobalFoundries,
    4. Events,
    5. FD-SOI
    Article: 3D Architectures for Semiconductor Integration and Packaging-rf-requirements-jpg

    "Mobile is the largest platform ever built by humanity", Christiano Amon, Executive Vice President, Qualcomm Technologies, Inc. and President, Qualcomm CDMA Technologies speaking at the GLOBALFOUNDRIES Technologies Conference (GTC) 2017.
    ...
    by Published on 10-20-2017 05:00 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. GlobalFoundries,
    4. Intel,
    5. Events,
    6. Silicon Photonics
    Need help with TSUPREME4 and MEDICI.-iedm-2017-jpg

    The 63rd annual IEDM (International Electron Devices Meeting) will be held December 2nd through 6th in San Francisco. In my opinion IEDM is one of, if not the premier conference on leading edge semiconductor technology. I will be attending the conference again this year ...
    by Published on 10-19-2017 10:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. FPGA,
    4. Menta
    Article: Happy Holidays-menta-efpga-architecture-jpg

    Writing a white paper is never tedious, and when the product or the technology is emerging, it can become fascinating. Like for this white paper I have written for Menta “How Standard Cell Based eFPGA IP are Offering Maximum Flexibility to New System-on-Chip Generation”. eFPGA technology is not really emerging, but it’s fascinating to describe ...
    by Published on 10-19-2017 05:00 AM
    1. Categories:
    2. FPGA,
    3. Events,
    4. Achronix,
    5. Artificial Intelligence
    Article: Apple Will NOT Manufacture SoCs at Intel-need-hardware-accelerators-min-jpg

    Accelerating compute-intensive software functions by moving them into hardware has a long history, stretching back (as far as I remember) to floating-point co-processors. Modern SoCs are stuffed with these applications, from signal processors, to graphics processors, codecs and many more functions. All of these accelerators work extremely well for ...
    by Published on 10-18-2017 10:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Methodics
    Article: Double Patterning Exposed!-hierarchy-min-jpg

    We recently saw both Apple and Samsung introduce new smart phones, and realize that the annual race to introduce sophisticated devices that are attractive and differentiated is highly competitive. If either of these companies misses a market window then fortunes can quickly change. SoCs with billions of transistors like smart ...
    by Published on 10-18-2017 05:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Mentor Graphics,
    4. ARM,
    5. Events
    Article: Double Patterning Verification-mentor-arm-techcon-jpg

    Next week is ARM TechCon which is one of my favorite conferences (SemiWiki is an event partner). This year is lucky number thirteen for ARM TechCon and it includes more than sixty hours of sessions plus more than one hundred ARM partners in the exposition. I will be signing free copies of our new book “Custom ...
    by Published on 10-17-2017 10:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Mentor Graphics,
    4. Automotive
    Article: A Brief History of the MIPS Architecture-autodefect-min-jpg

    When it comes to safety and automotive systems, ISO 26262 is the standard by which system vendors are judged. As with all things the devil is in the details. To be compliant to the standard, design teams must have a well-defined and rigorous design and validation process in place ...
    by Published on 10-17-2017 05:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. ANSYS, Inc.,
    4. TSMC,
    5. Automotive
    Article: Apple Will NOT Manufacture SoCs at Intel-ansys-coverage-automotive-electronics-min-jpg

    Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out ...
    by Published on 10-16-2017 10:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. Sidense,
    4. IoT Internet of Things,
    5. Security
    Article: Zynq out of the box, in FPGA-based prototyping-sidense-ecid-support-min-jpg

    As chips for any design are fabricated, it turns out that no two are the exactly the same. This is both a blessing and a curse. Current silicon fabrication technology is amazingly good at controlling factors that affect chip to chip uniformity. Nevertheless, each chip has different characteristics. The most ...
    by Published on 10-13-2017 10:00 AM
    1. Categories:
    2. Automotive,
    3. Artificial Intelligence
    Article: Apple Will NOT Manufacture SoCs at Intel-auro-robotics-jpg

    Some days it seems like the world is obsessed with autonomous vehicles. No one really understands why. Surveys tell us that consumers are both interested in and repelled by self-driving cars. What’s missing is the business model – the commercial ...

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