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    by Published on 12-10-2018 11:00 AM
    Research Study on Circuit Pads-semiconductor-equipment-top-7.jpg

    Semiconductor equipment vendor ranking, which didn’t change much between 2016 and 2017, is undergoing a makeover, as Lam Research, ASML, and Tokyo Electron (TEL) are switching places and top-ranked Applied Materials is getting closer to losing its number one ranking.

    Since the 1990s, Applied Materials has been the market leader in the semiconductor equipment ...
    by Published on 12-10-2018 06:00 AM
    1. Categories:
    2. Events
    Article: No EUV before 7nm?-iedm-2018.jpg

    Hello, my name is Daniel Nenni and I am a semiconductor conference addict. I just can’t seem to get enough. The semiconductor ecosystem is very wide now and moves so quickly it is nearly impossible to keep up without constant conference attendance. ...
    by Published on 12-09-2018 11:00 AM
    1. Categories:
    2. Automotive
    Tackling large-scale SoC and FPGA prototyping debug challenges-gm-stop-downsizing.jpg

    General Motors CEO Mary Barra is known for a number of quotes one of which is: “My father was a die maker for 39 years, so I had a basic understanding of the automobile industry and what the manufacturing world was like, just from the opportunity to spend time with him, just talking, because he was a car buff.” One has to wonder what Mary’s dad would have so say about the latest news out of GM.

    Two major press ...
    by Published on 12-09-2018 06:00 AM
    1. Categories:
    2. Automotive
    Research Study on Circuit Pads-volvo-car-less-better-than-clueless.jpg

    Sweden has embraced the movement toward a cashless society with banks no longer taking cash deposits and retailers, like Ikea, experimenting with cashlessness. Perhaps taking a cue from the Swedish financial sector, Volvo Cars last week revealed its plans for a car-less stand at this week’s L.A. ...
    by Published on 12-07-2018 11:00 AM
    1. Categories:
    2. Semiconductor Services,
    3. Semiconductor Advisors
    Article: Navigating the new patent landscape-huawei-suppliers-top-20.jpg

    In our recent note sent several days ago we suggested that the China conflict would come back to haunt the US chip industry. From a stock perspective we suggested taking short term gains from a recent bounce back off the table. Both ideas turned out true, but way faster than we had thought! Not only have investors figured out that the trade truce was hollow but just to make sure, the US had Huawei's ...
    by Published on 12-07-2018 06:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. ARM,
    4. IoT Internet of Things
    computer power growth-datacenter-min.jpeg

    At ARM TechCon this year, the company announced the Neoverse brand targeted to infrastructure, contrasting with the Cortex brand we are familiar with for edge devices such as smartphones and IoT devices. Cortex was already used in infrastructure, in networking, ...
    by Published on 12-06-2018 11:00 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. Events,
    4. Samsung Foundry
    Article: No EUV before 7nm?-es-jung-samsung.jpg

    IEDM is a premier semiconductor conference so it was certainly appropriate for Samsung to do the keynote since they are the largest and one of the most innovative semiconductor companies in the world, absolutely.

    Samsung is also one of the more interesting semiconductor companies ...
    by Published on 12-06-2018 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Automotive,
    4. RISC-V
    Research Study on Circuit Pads-risc-v-min.jpeg

    I met Imperas at TechCon this year because I wanted to become a bit more knowledgeable about virtual modeling. That led me to become more interested in RISC-V and a talk given by Krste Asanovic of UCB and SiFive. My takeaway surprised me. I had thought this ...
    by Published on 12-05-2018 06:00 AM
    1. Categories:
    2. Semiconductor Services,
    3. Semiconductor Advisors
    Article: No EUV before 7nm?-michael-ramirez.jpg

    At the recent trade talks in South America, the US and China both kicked the can down the road as neither one were obviously willing to do a deal nor had done any background work to get a deal done. Instead we have a bunch of empty promises and vague and conflicting descriptions of what was not really even agreed to.

    Essentially worthless
    However, the market was happy that nothing happened as stocks rallied based on hope that something might happen in the future as the ...
    by Published on 12-04-2018 11:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Cadence,
    4. Events,
    5. Automotive
    Article: UVM: Lowering the barrier to IP reuse-cadence_summit_1_1.jpg

    Cadence held a well-attended Automotive Summit where Cadence presented an overview of their solution and system enablement along with industry experts and established or startup companies sharing their perspective and product features from autonomous driving, LiDAR, Radar, thermal imaging, sensor imaging, and AI.


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