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  • Synopsys, ARM, Samsung, GLOBALFOUNDRIES (Part 1 of 2)

    Intro
    The 28nm nodes is ready with foundry silicon, IP and EDA tools. Tuesday morning at the DAC breakfast I learned more about the 28nm eco-system.
    Article: TSMC Versus The FabClub!-dac-tuesday-28nm-jpg


    Notes
    Why 32/28nm
    - Lower power, high integration requirements, mobile applications

    What is Ready?
    - IP is qualified (ARM, Memories, Foundation IP, SNPS IP, PDKs)
    - August 2010 SNPS and GLOBALFOUNDRIES at 28nm
    - June 2011 SNPS and ARM at 28nm (A15 core)
    - June 2010 Samsung at 32nm with SNPS tools
    - Common Platform – Lynx tool flow is ready, January 2011
    - June 2011 GLOBALFOUNDRIES ready at 28nm
    - Samsung qualifies 28nm
    - Samsung at 35 tape outs at 32nm to date


    Anna Hunter, VP Samsung
    Technology Roadmap
    - 32nm LP: ready, HKMG process
    o SRAM at .149um*um, tiny size
    o Good yield at 86%
    o Matches SPICE results
    - 28nm LP: ready
    o Same HKMG as 32nm node
    o Works with ARM IP and SNPS tool flow
    - 28nm LPH: under development (low power, plus higher performance modules)
    o Will be up to 50% faster (with more leakage, 2.3X)
    o Same HKMG
    o Added strain to silicon
    o Shuttles starting now
    - 20nm LPM: in development, PDK evaluation now. Ready by end of 2012.

    Lynx – flow of SNPS tools and IP management, used by Samsung internally too

    ARM CPU – 45nm >1GHz on Cortex A9
    - 32/28nm >1.35GHz on Cortez A15
    - 28nm LPH, >2.0GHz Cortex A15

    IP Portfolio – High Speed, Memory, Mixed Signal
    - ARM, SNPS<

    Going from 45nm to 32nm more than 50% improvement in SRAM bit cell size

    Turn key solutions from Samsung
    - Design, Fab, Wafer Sort, Assembly, Final Test
    - Working on TSV technology for higher integration on packaging

    MPW – Run every quarter for 32nm and 28nm
    - Will start 20nm in September

    Fab sites – Korea( 20nm), Texas (40K wafers per month)

    Jim Ballingall, VP Marketing at GLOBALFOUNDRIES
    - AMD lead product used HKMG technology, quad core CPU with GPU integrated, 500GFlops, for notebooks
    - Llano powered laptops later in June

    Super Low Power – 28nm SLP (doesn’t use stressing), about 2.3GHz

    High Performance Plus – 28nm HPP (uses stressing), about 3.1GHz

    Global Solutions – Design Solutions, Technology, Design Infrastructure<

    IP – in place

    Fabs – New York, Germany, Singapore

    MPW – 4 shuttles in 2011

    20nm – working with Common Platform partners, area scaling of 50% from 28nm

    This article was originally published in forum thread: Best #48DAC Trip Report Gets an iPAD2 started by admin View original post