You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!

  • Start Your HBM 2.5D Design Today!

    Article: It Takes a Village: Mentor and ARM Team Up on Test-hbm-25d-chip1-min.jpgNext week there is a live seminar at the famed Computer Museum in Silicon Valley that you won’t want to miss. If you haven’t been to the Computer Museum here is what you are missing:

    Spend a day at the Computer History Museum. Find out why computer history is 2000 years old. Learn about computer history´s game-changers in our multimedia exhibitions. Play a game of Pong or Spacewar! Listen to computer pioneers tell their story from their own perspective. Discover the roots of today´s Internet and mobile devices. See over 1,100 historic artifacts, including some of the very first computers from the 1940s and 1950s.

    Even if you have been to the Computer Museum here is what you will be missing if you don't attend: FREE food/drinks and the opportunity to mingle with 100+ of Silicon Valley’s finest. And this just in: There will be 5 raffle prizes at the event: iWatch, iPad mini, Kindle, Drone, Amazon Echo. Personally I would go for the Echo. We have one and it is a very nice piece of technology:

    About the Seminar:
    SK Hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. This seminar will present a complete HBM supply chain that is delivering and supporting customer HBM designs now.

    REGISTER HERE

    It's kind of unique to have five companies all present how they contribute to one solution. Here are the speakers and what they will cover:

    • 3D memory stack, Kevin Tran, Senior Manager, Technical Marketing, SK Hynix


    • Interposer & assembly, Paul Silvestri, Director of TSV Product Development, Amkor Technology


    • 2.5D package, silicon die & HBM PHY, Bill Isaacson, Director, ASIC Product Marketing, eSilicon


    • HBM controller, Brian Daellenbach, President, Northwest Logic


    • System verification & optimization, Chris Browy, Senior VP, WW Sales and Marketing, Avery Design Systems

    There will be 2 hours of presentations - a 20 minute presentation and a 5 minute Q&A for each speaker. That will be followed by an hour of wine/beer/food reception and networking. Each company will have a table for the networking reception. eSilicon will demonstrate online quoting tools and IP browsing. Avery will demo their verification/optimization tool using a design that contains the Northwest Logic HBM controller and the eSilicon HBM PHY. eSilicon will also have some "show and tell" with real hardware. I hope to see you there!

    REGISTER HERE

    What We Do
    eSilicon provides products and services to the global semiconductor industry. Our services include ASIC design services and the coordination of the global, outsourced manufacturing supply chain that implements those custom integrated circuits. We call this model semiconductor manufacturing services. We deliver the manufactured custom ICs in volume to our customers at a pre-negotiated price.

    We also develop memory IP and I/O products, both off the shelf and custom. Our customers are semiconductor companies, integrated device manufacturers, original equipment manufacturers and wafer foundries that sell their products into a variety of end markets, including communications, computing, consumer, industrial and medical products.