Moore’s is still the law, and device scaling remains the key focus of front-end process research, however next-generation technologies–and the Big Data, cloud computing world that supports mobile, IoT, and other next-gen applications–are the new drivers, bringing new demands and challenges running parallel with Moore’s Law.
450mm, EUV, and 3D IC may have hit bumps on the road to the future, but their progress still drives the discussion and the debate over what comes next for the microelectronics industry.
Advanced Device Manufacturing Drives the Discussion at SEMICON West 2014
SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing, featuring technologies from across the microelectronics supply chain, from electronic design automation, to device fabrication (wafer processing), to final manufacturing (assembly, packaging, and test). More than semiconductors, SEMICON West is also showcase for emerging markets and technologies born from the microelectronics industry, including micro-electromechanical systems (MEMS), photovoltaics (PV), flexible electronics and displays, nano-electronics, solid state lighting (LEDs), and related technologies.
Add a paid program and get your exhibits pass FREE!
Add just one paid program to your SEMICON West registration and your exhibits pass is FREE! That’s a savings of $150 onsite–PLUS Early Bird pricing on programs is good through June 6, saving you even more! Register now!
Paid SEMI Technology Symposium (STS) packages include premium content, guaranteed seating, and networking lunches!
Device Manufacturing/Wafer Processing Highlights at SEMICON West 2014
[TABLE] style=”width: 430px”
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| colspan=”2″ align=”left” valign=”top” style=”width: 430px” | Tuesday, July 8, 2014
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| colspan=”2″ align=”left” valign=”top” style=”width: 430px” |
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| align=”left” valign=”top” style=”width: 150px” | 9:00am-12:00pm
| align=”left” valign=”top” style=”width: 280px” | STS Session: Challenges, Innovations and Drivers in Metrology
Session Partner: SEMATECH
Moscone North, Hall E, Room 130
Paid session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| align=”left” valign=”top” width=”150″ | 1:30pm-4:30pm
| align=”left” valign=”top” width=”280″ | Yield Session: Defectivity and Process Variability, Inspection, Defect Reduction Challenges and Process Controls at the Sub 20nm Nodes
Session Partner: SEMATECH
Moscone North, Hall E, Room 130
Paid session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| align=”left” valign=”top” width=”150″ | 1:30pm-3:30pm
| align=”left” valign=”top” width=”280″ | Variability Control – A Key Challenge and Opportunity for Driving Towards Manufacturing Excellence
TechXPOT South, South Hall
Free session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| colspan=”2″ align=”left” valign=”top” width=”430″ | Wednesday, July 9, 2014
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| align=”left” valign=”top” width=”150″ | 9:00am-12:00pm
| align=”left” valign=”top” width=”280″ | Getting to 5nm Devices: Evolutionary Scaling to Disruptive Scaling and Beyond
Moscone North, Hall E, Room 131
Paid session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| align=”left” valign=”top” width=”150″ | 10:30am-12:30pm
| align=”left” valign=”top” width=”280″ | Subcomponent Supply Chain Challenges for 10 nm and Beyond
Hosted by: SEMI Semiconductor Components, Instruments, and Subsystems Special Interest Group
TechXPOT South, South Hall
Free session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| align=”left” valign=”top” width=”150″ | 1:30pm-4:30pm
| align=”left” valign=”top” width=”280″ | Readiness of Advanced Lithography Technologies for High-Volume Manufacturing
Moscone North, Hall E, Room 131
Paid session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
|-
| align=”left” valign=”top” width=”150″ | 1:30pm-3:30pm
| align=”left” valign=”top” width=”280″ | Productivity Solutions for 300mm and Smaller
Hosted by the Secondary Equipment and Applications Americas Chapter
TechXPOT South, South Hall
Free session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| colspan=”2″ align=”left” valign=”top” width=”430″ | Thursday, July 10, 2014
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| align=”left” valign=”top” width=”150″ | 9:00am-12:00pm
| align=”left” valign=”top” width=”280″ | STS Session: 450mm Technology Development Update
Moscone North, Hall E, Room 131
Paid session
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| colspan=”2″ align=”left” valign=”top” width=”430″ |
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| align=”left” valign=”top” width=”150″ | 1:30pm-3:30pm
| align=”left” valign=”top” width=”280″ | STS Session: Breakthrough High Volume Manufacturing Innovations: New paradigms for the Road Ahead
Moscone North, Hall E, Room 131
Paid session
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Register now and save! Early Bird pricing ends June 6
SEMICON West 2014
Exhibits: July 8-10
Programs: July 7-11
Moscone Center
San Francisco, CA
www.semiconwest.org
#semiconwest
Other SEMI Events
SEMI Member Day (Aurora, IL) — May 29
An exclusive SEMI member event in the North Central region.
Northeast Tech Talk (Billerica, MA) — June 25
From Paper to e-Paper; How E ink Display Technology is Changing the World
Strategic Materials Conference (SMC 2014) — September 30-October 1
Materials Matter–Enabling the Future of IC Fabrication and Packaging
International Technology Partners Conference — November 9-12
New Structures for Innovation
Industry Strategy Symposium – ISS 2015 (Half Moon Bay, CA) — January 11-14
“Riding the Wave of Silicon Magic”
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