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  1. Moore, or More Than Moore?

    Published by Paul McLellan, 4 Weeks Ago 10:05 AM Tags: foundry  fabless  28nm  semiconductor  gsa  20nm  sip  14nm  interposer  tsv  2.5d  3dic  10nm  silicon summit  gsasummit 
    • Comments: 0

    CMS:
    Global Semiconductor Alliance

  2. 3D IC: Are We There Yet?

    Published by Paul McLellan, 04-13-2013 02:42 PM Tags: semiconductor  3d ic  interposer  tsv  2.5d  edps 
    • Comments: 5
    Last Post: 3 Weeks Ago 04:01 PM
    by LinkedIn 

    CMS:
    Events

  3. Modeling TSV, IBIS-AMI and SERDES with HSPICE

    Published by daniel_payne, 02-21-2013 06:10 PM Categories: EDA  Synopsys  Tags: synopsys  hspice  amd  altera  serdes  circuit simulation  micron  tsv  sig  2013 
    • Comments: 7
    Last Post: 03-02-2013 07:58 AM
    by daniel_payne 

    CMS:
    Synopsys

  4. Cadence 3D Methodology

    Published by Paul McLellan, 12-28-2012 06:20 PM Tags: cadence  eda  semiconductor  3d ic  interposer  2.5d ic  tsv  3dic 
    • Comments: 4
    Last Post: 12-30-2012 01:10 PM
    by daniel_payne 

    CMS:
    Cadence Design Systems

  5. 3D Architectures for Semiconductor Integration and Packaging

    Published by Paul McLellan, 12-10-2012 02:00 AM Tags: eda  semiconductor  3d ic  interposer  2.5d ic  tsv  3dic  thru silicon via 
    • Comments: 1
    Last Post: 12-11-2012 03:32 PM
    by LinkedIn 

    CMS:
    The Front Page

  6. Dimensions of Electronic Design Seminars

    Published by Paul McLellan, 10-02-2012 04:37 PM Tags: eda  semiconductor  apache  ansys  tsv  3dic  2.5dic  antennas  complexity 
    • Comments: 0

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  7. 3D Memories

    Published by Paul McLellan, 09-02-2012 02:42 PM Tags: eda  semiconductor  apache  ansys  micron  tsv  3dic  hmc 
    • Comments: 0

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  8. 3D Thermal Analysis

    Published by Paul McLellan, 07-17-2012 09:32 AM Tags: eda  semiconductor  apache  tsv  2.5d  3dic  thermal  2.5dic 
    • Comments: 3
    Last Post: 07-19-2012 01:44 AM
    by simguru 

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  9. Cadence at Semicon West Next Week: 2.5D and 3D

    Published by Paul McLellan, 07-05-2012 03:32 PM Tags: cadence  eda  semiconductor  interposer  tsv  3dic  2.5dic 
    • Comments: 0

    CMS:
    Cadence Design Systems

  10. 1,000,000,000,000 Transistor IC Layout Editing at DAC

    Published by daniel_payne, 06-11-2012 04:33 PM Categories: EDA  Tags: eda  semiconductor  3d ic  tsv  micro magic 
    • Comments: 0

    CMS:
    The Front Page

  11. EDPS: 3D ICs, part I

    Published by Paul McLellan, 04-10-2012 08:00 PM Tags: 3d ic  qualcomm  interposer  2.5d ic  tsv  2.5d 
    • Comments: 1
    Last Post: 04-12-2012 02:28 PM
    by John Swan 

    CMS:
    Events

  12. Synopsys: now in 3D

    Published by Paul McLellan, 03-26-2012 06:00 AM Tags: 3d ic  interposer  2.5d ic  tsv 
    • Comments: 0

    CMS:
    Synopsys

  13. 3D Standards

    Published by Paul McLellan, 02-01-2012 03:06 PM Tags: eda  semiconductor  si2  interposer  tsv  2.5d  3d ics  2.5d ics 
    • Comments: 0

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  14. Going up...3D IC design tools

    Published by Paul McLellan, 01-23-2012 04:41 PM Tags: 3d chips  test  interposer  physical verification  tsv  2.5d chips 
    • Comments: 3
    Last Post: 01-26-2012 11:25 PM
    by John Swan 

    CMS:
    Mentor Graphics

  15. Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!

    Published by Daniel Nenni, 01-29-2012 02:00 PM Tags: semiconductor  3d ic  sip  global unichip  guc  interposer  2.5d ic  ipd technology  tsv  flexible asic tsmc 
    • Comments: 9
    Last Post: 02-20-2012 07:46 PM
    by LinkedIn 

    CMS:
    Global Unichip Corp.

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