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Tag: 3dic

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  1. Moore, or More Than Moore?

    Published by Paul McLellan, 04-19-2013 10:05 AM Tags: foundry  fabless  28nm  semiconductor  gsa  20nm  sip  14nm  interposer  tsv  2.5d  3dic  10nm  silicon summit  gsasummit 
    • Comments: 0

    CMS:
    Global Semiconductor Alliance

  2. Cadence 3D Methodology

    Published by Paul McLellan, 12-28-2012 06:20 PM Tags: cadence  eda  semiconductor  3d ic  interposer  2.5d ic  tsv  3dic 
    • Comments: 4
    Last Post: 12-30-2012 01:10 PM
    by daniel_payne 

    CMS:
    Cadence Design Systems

  3. Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis

    Published by Paul McLellan, 12-16-2012 08:00 PM Tags: eda  designcon  semiconductor  3d ic  apache  ansys  3dic  thermal  thermal analysis  transmission line  low frequency  s-parameter model 
    • Comments: 1
    Last Post: 12-16-2012 10:48 PM
    by Kamal Karimanal 

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  4. 3D Architectures for Semiconductor Integration and Packaging

    Published by Paul McLellan, 12-10-2012 02:00 AM Tags: eda  semiconductor  3d ic  interposer  2.5d ic  tsv  3dic  thru silicon via 
    • Comments: 1
    Last Post: 12-11-2012 03:32 PM
    by LinkedIn 

    CMS:
    The Front Page

  5. Dimensions of Electronic Design Seminars

    Published by Paul McLellan, 10-02-2012 04:37 PM Tags: eda  semiconductor  apache  ansys  tsv  3dic  2.5dic  antennas  complexity 
    • Comments: 0

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  6. 3D Memories

    Published by Paul McLellan, 09-02-2012 02:42 PM Tags: eda  semiconductor  apache  ansys  micron  tsv  3dic  hmc 
    • Comments: 0

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  7. 3D Thermal Analysis

    Published by Paul McLellan, 07-17-2012 09:32 AM Tags: eda  semiconductor  apache  tsv  2.5d  3dic  thermal  2.5dic 
    • Comments: 3
    Last Post: 07-19-2012 01:44 AM
    by simguru 

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  8. Cadence at Semicon West Next Week: 2.5D and 3D

    Published by Paul McLellan, 07-05-2012 03:32 PM Tags: cadence  eda  semiconductor  interposer  tsv  3dic  2.5dic 
    • Comments: 0

    CMS:
    Cadence Design Systems

  9. TSMC Theater Presentation: Apache

    Published by Paul McLellan, 06-24-2012 10:13 PM Tags: eda  tsmc  redhawk  semiconductor  power  apache  ansys  3dic 
    • Comments: 0

    CMS:
    Apache Design, Inc., A Subsidiary of ANSYS, Inc.

  10. GSA 3DIC and Cadence

    Published by Paul McLellan, 04-29-2012 08:00 PM Tags: cadence  semiconductor  gsa  interposer  2.5d  3dic 
    • Comments: 0

    CMS:
    Cadence Design Systems

  11. Keeping Moore's Law Alive

    Published by Paul McLellan, 04-27-2012 10:37 AM Tags: eda  ibm  moore's law  semiconductor  3d ic  gsa  dram  3dic  soi 
    • Comments: 4
    Last Post: 05-03-2012 05:51 AM
    by Staf_Verhaegen 

    CMS:
    Events

  12. U2U Mentor Users' Group

    Published by Paul McLellan, 04-04-2012 08:58 AM Tags: mentor  user group  users group  rhines  3dic 
    • Comments: 0

    CMS:
    Mentor Graphics

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