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The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. No less than 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. A highlight of DAC is its exhibition and suite area with over 200 of the leading and emerging EDA, silicon, intellectual property (IP) and design services providers. The conference is sponsored by the Association for Computing Machinery (ACM), the Electronic Design Automation Consortium (EDA Consortium), and the Institute of Electrical and Electronics Engineers (IEEE), and is supported by ACM's Special Interest Group on Design.

Total conference attendance at the 2012 Design Automation Conference (DAC), the premier event on automation and design of electronic systems, increased by 16% compared to DAC 2011, according to the 49th DAC Executive Committee (EC). The 49th DAC exhibitor floor was open from June 4-6, 2012 at the Moscone Center in San Francisco, California, with technical sessions running from June 3-7.

Preliminary attendance figures for the 49th DAC break down as follows:
  • Conference attendees – 1901, up 9%
  • Exhibits only passes – 2783, up 39%
  • Exhibitors booth staff – 2704, up 11%


Networking opportunities abounded on the exhibit floor, in poster sessions, at the evening receptions, and in the technical sessions, proving that DAC is the conference to attend for electronic design and embedded systems and software.

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CompanyEDA or IPDAC Trip Report
Ansys2.5D, 3D PowerTSMC Theater Presentation: Apache
ARMSemiconductor IPMike Muller's ARM Keynote at DAC 2012
AsygnAnalog MacromodelsAnalog Macromodels at DAC
AtrentaSoft IP ValidationTSMC Theatre Presentation: Atrenta SpyGlass!
SpyGlass by Atrenta
Berkeley DAAnalog FastSPICETSMC Theater Presentation: Berkeley DA
Analog FastSPICE update at DAC
Cadence DesignIC module generatorsST Using Cadence IC Tools with Module Generators at DAC
3D PackagingCadence/TSMC 3D
Panel DiscussionCollaboration at 28nm, 20nm and 14nm: IBM, Cadence, ARM, GLOBALFOUNDRIES, Samsung
Photo EssayPhoto Essay and Comments on DAC 2012 in San Francisco, CA
CiranovaIC custom layoutTSMC Theatre Presentation: Ciranova!
Custom IC Layout Automation at DAC
Concept EngineeringSchematic visualizationFrom SPICE Netlist back to Schematics at DAC
DACMarie Pistilli AwardBelle Wei Receives Marie Pistilli Award and is Interviewed
Photo, VideoPhoto and Video overview of DAC 2012
Dassault SystemsDesign Data ManagementDesignSync update from Dassault Systems at DAC
DXCorrIP: LibrariesPhysical IP Not from ARM or Synopsys
eSilicon,
IBM,
nVidia
PartitioningPartitioning Panel
Global UnichipIC Design ServicesTSMC Theater Presentation: Production Proven Design Services Driving SoC Innovation!
IC ScapeIC schematic, layout, closure toolsSchematic, IC Layout, Clock and Timing Closure from IC Scape at DAC
InfiniscaleMonte CarloFast Monte Carlo from Infiniscale at DAC
Invarian3D Thermal and Stress3D Thermal and Mechanical Stress for IC Packaging at DAC
IPL AllianceInteroperable PDKsIPL Alliance at DAC
iROCSER simulationSoft Error Rate predicion Software
JedatIC layoutIC Layout Tools from Japan at DAC
Lorentz SolutionEM Design and AnalysisTSMC Theater Presentation: Lorentz Solution!
Mentor GraphicsIC P&R, custom layout, SPICEA DAC Update on IC Layout and Circuit Simulation Tools
Multi-PatterningDouble Patterning Technology at DAC
Video: CEO InterviewWalden Rhines at DAC 2012
AMS SimulationAMS Simulation Update from Mentor Graphics at DAC
MethodicsDesign Data ManagementMethodics update at DAC
MicroMagicIC layout1,000,000,000,000 Transistor IC Layout Editing at DAC
MunEDATransistor OptimizationRobustness, Reliability and Yield at DAC
NimbicEM SimulationElectromagnetic Simulation Update from Nimbic at DAC
OasysLogic SynthesisChip Synthesis at DAC
Oski TechnologyConsulting: FormalFinding RTL Bugs Live at DAC Using Formal Techniques
ProPplusAnalog Fast SPICEFast Monte Carlo and Analog Fast SPICE from ProPlus at DAC
PulsicP&RShape-based IC Routing at DAC
SolidoDesign centeringEDA Tools to Optimize Memory Design, Size Standard Cells, Verify Low-Power Design, Center Analog Designs
SpringSoftIC LayoutLaker IC Layout Update at DAC
SymicaFast SPICEFast SPICE from Kiev at DAC
SynopsysSPICEWhat's New With HSPICE at DAC?
Panel DiscussionSamsung, Synopsys, GLOBALFOUNDRIES and ARM at DAC
Z-CircuitCell characterizationIC Cell Library Characterization at DAC













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Bringing DAC to Austin
Major Employers of Design Engineers in Austin

  • 3M Co. (1000)
  • Advanced Micro Devices (2933)
  • Agere,Inc.
  • Alereon
  • Analog Devices
  • Aperian
  • Apple (3000)
  • Applied Materials (2250)
  • Applied Micro
  • Applied Science Fiction
  • ASI (Advanced System Integration)
  • BAE Systems (675)
  • Cirrus Logic
  • Cisco Systems (800)
  • Cypress
  • DuPont Photomasks Inc.
  • Flextronics (1875)
  • Freescale Semiconductor (5000)
  • Hewlett-Packard (550)
  • IBM Corp. (6239)
  • Image Microsystems (500)


  • Intel Corp. (1000)
  • Motorola
  • National Instruments (2200)
  • Oracle (515)
  • Photronics
  • PulsewaveRF
  • Qualcomm
  • Rocket Chips
  • Samsung (1100)
  • SGI
  • Silicon Group Inc., The
  • Silicon Hills Design Inc.
  • Silicon Laboratories (500)
  • SMSC
  • Spansion (900)
  • Stellar Micro Devices
  • TI (Dallas)
  • Tokyo Electron America Inc.
  • Vitesse Semiconductor
  • WindRiver Systems



DAC has drawn attendees from the following
companies located in the Austin area for over 50 years


  • Advanced Micro Devices (AMD)
  • Agilent Technologies
  • Applied Micro
  • ARM
  • ASSET InterTech
  • Biotroniik/MSEI
  • Broadcom
  • Callidus Systems
  • Catalyte IC Design
  • Centaur Technology
  • Cyclic Design
  • DSM Silicon Solutions, LLC
  • Fabtech
  • Freescale
  • Fujitsu Network Communications
  • Futurewei Technologies
  • HDL Dynamics
  • Hewlett Packard
  • HighIP Design Company
  • Huawei
  • IBM
  • Intel
  • InternetCAD.com, Inc.
  • L-3 Communications MID
  • LFoundry GmbH
  • Logic Refinery, Inc.
  • Low Power Design
  • LSI
  • Marvell
  • Matricus, Inc.
  • Maxim Integrated Product
  • Microtune


  • Mimasic
  • Motorola
  • NASA
  • National Instruments
  • Nokia Inc
  • Omnibase Logic
  • ON Semiconductor
  • Oracle
  • PDF Solutions
  • Perception Software
  • Qualcomm
  • Raytheon
  • Samsung
  • Saratoga Data Systems
  • Signet Design Solutions, Inc.
  • Silicon Laboratories
  • SiliconAid Solutions
  • SiliconXpress, Inc
  • SMSC
  • Solid Oak Technologies
  • ST Microelectronic
  • Standard Microsystems
  • SystematIC Design
  • TelNet Management
  • Texas Instruments
  • The Aerospace Corp.
  • Triune Systems
  • Verilab
  • Vitesse
  • Wipro Technologies
  • XtremeESL Corporation
  • Zarlink Semiconductor
  • Zoran




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