Call for Papers ASP-DAC 2013
18th Asia and South Pacific Design Automation Conference 2013
Jan. 22-25, 2013, Pacifico Yokohama, Yokohama, Japan
- Aims of the Conference:
ASP-DAC 2013 is the eighteenth annual international conference on VLSI
design automation in Asia and South Pacific region, one of the most active
regions of design and fabrication of silicon chips in the world.
The conference aims at providing the Asian and South Pacific CAD/DA and
Design community with opportunities of presenting recent advances and with
forums for future directions in technologies related to Electronic Design
Automation (EDA). The format of the meeting intends to cultivate and
promote an instructive and productive interchange of ideas among EDA
researchers/developers and system/circuit/device designers. All scientists,
engineers, and students who are interested in theoretical and practical
aspects of VLSI design and design automation are welcomed to ASP-DAC.
- Areas of Interest:
Original papers on, but not limited to, the following areas are invited.
Please note that ASP-DAC will work cooperatively with other conferences
and symposia in the field to check for double submissions.
 System-Level Modeling and Simulation/Verification:
System-level modeling, specification, language, performance analysis,
system-level simulation/verification, hardware-software
 System-Level Synthesis and Optimization:
System-on-chip and multi-processor SoC (MPSoC) design methodology,
hardware-software partitioning, hardware-software co-design,
IP/platform-based design, application-specific instruction-set processor
(ASIP) synthesis, low power system design, etc.
 System-Level Memory/Communication Design and Networks on Chip:
Communication-based architecture design, network-on-chip (NoC) design
methodologies and CAD, interface synthesis, system communication
architecture, memory architecture, low power communication design, etc.
 Embedded and Real-Time Systems:
Embedded system design, real-time system design, OS, middleware,
compilation techniques, memory/cache optimization, interfacing and
 High-Level/Behavioral/Logic Synthesis and Optimization:
High-Level/behavioral/RTL synthesis, technology-independent optimization,
technology mapping, interaction between logic design and layout,
sequential and asynchronous logic synthesis, resource scheduling,
allocation, and synthesis.
 Validation and Verification for Behavioral/Logic Design:
Logic simulation, symbolic simulation, formal verification, equivalence
checking, transaction-level/RTL and gate-level modeling and validation,
assertion-based verification, coverage-analysis, constrained-random
 Physical Design:
Floorplanning, partitioning, placement, buffer insertion, routing,
interconnect planning, clock network synthesis, post-placement
optimization, layout verification, package/PCB routing, etc.
 Timing, Power, Thermal Analysis and Optimization:
Deterministic and statistical static timing analysis, statistical
performance analysis and optimization, low power design, power and
leakage analysis, power/ground and package analysis and optimization,
thermal analysis, etc.
 Signal/Power Integrity, Interconnect/Device/Circuit Modeling and
Signal/power integrity, clock and bus analysis, interconnect and
substrate modeling/extraction, package modeling, device
modeling/simulation, circuit simulation, high-frequency and
electromagnetic simulation of circuits, etc.
 Design for Manufacturability/Yield and Statistical Design:
DFM, DFY, CAD support for OPC and RET, variability analysis, yield
analysis and optimization, reliability analysis, design for resilience and
robustness, cell library design, design fabrics, etc.
 Test and Design for Testability:
Testable design, fault modeling, ATPG, BIST and DFT, memory test and
repair, core and system test, delay test, analog and mixed signal test.
 Analog, RF and Mixed Signal Design and CAD:
Analog/RF synthesis, analog layout, verification and simulation techniques,
noise analysis, mixed-signal design considerations.
 Emerging Technologies and Applications
i. Design case studies for emerging applications: multimedia, consumer
electronics, communication, networking, ubiquitous computing and
biomedical applications, etc. ii. Post CMOS technologies: nanotechnology,
quantum, optical interconnect, 3D integration, probabilistic architecture,
emerging memory technologies, microfluidics, molecular, bioelectronics,
etc., with emphasis on modeling, analysis, novel circuit/architecture, CAD
tools, and design methodologies.
* ASP-DAC 2013 University LSI Design Contest encourages submitting
original papers on LSI design and implementation at universities and
other educational organizations.
- Submission of Papers:
Deadline for submission: 5 PM JST (UTC+9) July 13 (Fri.), 2012
Notification of acceptance: Sep. 12 (Wed.), 2012
Deadline for final version: 5 PM JST (UTC+9) Nov. 14 (Wed.), 2012
Specification of the paper submission format is available at the WEB site:
18th Asia and South Pacific Design Automation Conference (ASP-DAC 2013)
- Prospective Sponsors:
ACM SIGDA, IEEE CASS, IEICE ESS, IPSJ SIG-SLDM
- ASP-DAC2013 Chairs:
General Chair: Shinji Kimura (Waseda Univ.)
Technical Program Chair: Yuan Xie (Pennsylvania State Univ.)
Technical Program Vice Chairs: Nagisa Ishiura (Kwansei Univ.)
Huazhong Yang (Tsinghua Univ.)
Conference Secretariat: aspdac2013-sec [at] mls.aspdac.com
TPC Secretariat: aspdac2013-tpc [at] mls.aspdac.com