Simulation Technique for Thermally Aware 3D TSV IC Stacking
Join us for a webinar on Aug 22, 2012 at 12:00 PM PDT.
Cielution invites you to join this free webinar on WholisticThermal modeling of 3D stacked ICs. Following is the agenda:
- The need for Thermally aware IC design
- Case Study: Implications of hot spots in a 3D stack with interposer and stacked memory
- Validation of Compact Thermal model of the 3D stack
- Results and discussion
Who should attend:Potential customers of Cielution with an interest in 3D enablement challenges.Kindly register with your organization email address (you will not be spammed).Registration from personal email IDs such as gmail & Yahoo accounts willnot be approved unless you are already in one of Cielutions linkedin contactsor Google + circle.
After registering, you will receive a confirmation emailcontaining information about joining the webinar.
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