More than 30 people attended our April 20 meeting and enjoyed a 5-star breakfast menu. Another 30 persons participated remotely and had to provide their own food and drinks.
After outlining the agenda, Herb emphasized that DAC 2011 is only 6 weeks away.
All the companies and industry organizations invited to submit their contributions to the 3D Tour Guide for DAC 2011 need to submit their inputs NO LATER THAN April 29 (THIS Friday) to take advantage of this FREE opportunity to promote their 2.5D and 3D strengths.
As a reference, last year's 3D Tour Guide is posted on the GSA web at:
Herb emphasized that the initial "Killer Application" for 3D Technology is clearly MIDs (Mobile Internet Devices). Stacking one or several memory die on top of one logic die saves a lot of space and power, compared to today's PoP and SiP solutions. In addition, the wide I/O standard makes displaying HD video practical on MIDs, without requiring big batteries.
After showing a new multi-color chart comparing strengths and weaknesses of 2D SoCs and 3D implementation alternatives, Herb introduced the 3 guest speakers Phil, Javier and Sumit.
For more contact email@example.com
Phil Marcoux runs his own consulting firm (PPM Associates) and has many years experience with IC Packaging, especially Surface Mount Technologies and MCMs.
He emphasized that the demand for smaller, faster and cheaper packaging continues and both 2.5D as well as 3D Technology promise to meet these ever invreasing demands.
Phil highlighted the evolutionary nature of 2.5D for manufacturing and confirmed that the current EDA design tools are typically sufficient for 2.5D ICs, if the use of TSVs is limited to the interposer. In contrast, 3D technology is a revolutionary step and requires new manufacturing- and test capabilities, as well as more EDA tools for planning/partitioning, die-package co-design, estimating the impact of TSVs on surrounding circuitry, for on-chip temperature analysis, thermally induced stress, etc.
Phil explained very well the benefits and cost implications of different types of TSVs, drew parallels with MCMs and vias in PCBs and gave us a lot of useful advise for early adopters of 2.5D and 3D technology.
Last but not least, he reminded us that investing in a new technology early may be costly but can be very, very rewarding.
For more contact Phil at onePPM@ymail.com.
3D Silicon Interconnect
Javier de la Cruz is the director of manufacturing technology at eSilicon. He outlined the useful role eSilicon plays in the established "2D SoC" eco-system and projected the value his team can bring to the rapidly emerging and much more complex 3D eco-system.
Like the previous presenter, Javier shared his view of the 2.5D & 3D benefits with us and showed us why and how eSilicon's "Modular Z-Axis IC" (MoZAIC) Concept can speed time to market and lower cost for 2.5D projects.
Javier explained cost comparisons of several designs and summarized clearly in which scenarios the use of these new technologies makes business sense - in addition to the technical benefits (power, speed, size,...) - 2.5D and 3D technologies offer in most scenarios.
He explained their MoZAIC program and showed that eSilicon's many ecosystem partners are ready or getting ready to start 2.5D and 3D designs and production.
For more contact JdelaCruz@eSilicon.com
Si2 update on 3D Design Flow Standardization Efforts
Sumit Dasgupta opened by summarizing the benefits 2.5D & 3D will offer system- and IC designers and their companies. Then he showed a list of R & D topics identified at the 3D workshop Si2 and GSA had organized in 2009.
Unlike at that time, today the customer demand for 3D design flows and 3D standards is much stronger, therefore Si2 has allocated engineering resources and is in discussions with more than 10 customers to start the Open3D Project at DAC in June 2011.
Sumit showed how Si2 will interact with many other standards organizations and R & D centers and outlined the basic 3D design flow as well as the goals of the Open3D Project.
Then Sumit emphasized that ALL Si2 member companies can join the Open3D Project at no additional cost for the remainder of 2011. Non-members only need to pay the regular Si2 membership fees to become contributing and voting members of the Open3D project, in addition to enjoying all other benefits of Si2 membership.
For more contact Dasgupta@Si2.org
GSA activities, need for standards
After our guest speakers shared their commitment to and readiness for 2.5 & 3D projects, Herb showed a few more slides explaining the importance of industry-wide cooperation and standards for design and manufacturing --- to reduce time to market and lower unit cost.
Both can improve our margins and will minimize surprises, redesigns and failed projects.
In the posted presentation is also a slide listing pointers to books and other info sources to quickly get up to speed on 2.5D and 3D challenges and solutions.
Herb also showed pointers to recent 3D related events where GSA contributed and reminded us that on the first day of DAC 2011 (Monday, June 6, 10.30 am) he'll moderate a 3D discussion with panelists from Qualcomm, TSMC and Xilinx. See more at: DAC - DAC 2011 - DAC 2011 Exhibits - Pavilion Panels
Right after this panel GSA plans to distribute the 3D Tour Guide with the information provided by companies and organizations the GSA invited.
The next EDA Interest Group meeting will be after the DAC hectic and the well-deserved summer vacation in late August or early September.
Agenda and location will be publicized about a month before the meeting, call-in and log-in numbers for remote participation will be distributed several days before the event.
As always, all slides presented on April 20 are posted on the GSA web at: GSA EDA / Design | Global Semiconductor Alliance