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  • MOS-AK/GSA Munich Workshop

    The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, completed its annual spring compact modeling workshop on April 11-12, 2013 at the Institute for Technical Electronics, TUM, Munich. The event received full sponsorship from leading industrial partners including MunEDA and Tanner EDA. The German Branch of IEEE EDS was the workshop technical program promoter. More than 30 international academic researchers and modeling engineers attended three sessions to hear 12 technical compact modeling presentations.

    The workshop's three sessions focused on common compact modeling actions. Sessions included: How to consolidate and build consistent simulation hierarchy at all levels of advanced TCAD numerical modeling; Compact/SPICE modeling for Analog / Mixed Signal circuits; and Corner modeling and statistical simulations.

    The MOS-AK/GSA speakers discussed: statistical modeling with backward propagation of variance (BPV) and covariance equations (K.-W. Pieper; Infineon); circuit sizing: corner model challenges and applications (M. Sylvester; MunEDA); compact modeling activities in the framework of the EU-Funded "COMON" project (B. Iñiguez; URV); effective device modeling and verification tools (I. Nickeleit; Agilent); modeling effects of dynamic BTI degradation on analog and mixed-signal CMOS circuits (L. Heiss; LTE, TUM); STEEPER: tunnel field effect transistors (TFETS) technology, devices and applications (T. Schulz; Intel); current and future challenges for TCAD (C. Jungemann; RWTH); advances in Verilog-A compact semiconductor device modeling with Qucs/QucsStudio (M. Brinson; London Metropolitan University); FDSOI devices bentchmarking (B.-Y. Nguyen; SOITEC); COMON: SOI multigate devices modeling (A. Kloes; THM); COMON: FinFET modeling activities (U. Monga; Intel); COMON: HV MOS devices modeling (M. Bucher; TUC).

    The event was accompanied by a series of the software/hardware demos by MOS-AK/GSA industrial partners: Agilent, MunEDA and Tanner EDA. The session technical and software/hardware demo presentations are available for download at: http://www.mos-ak.org/munich_2013/

    The MOS-AK/GSA Modeling Working Group is coordinating several upcoming modeling events: a special compact modeling session at the MIXDES Conference in Gdynia (https://www.mixdes.org); an autumn Q3/2013 MOS-AK/GSA workshop in Bucharest, a winter Q4/2013 MOS-AK/GSA meeting in Washington DC, and a spring Q2/2014 MOS-AK/GSA meeting in London (http://www.mos-ak.org).



    About MOS-AK/GSA Modeling Working Group:
    In January 2009, GSA merged its efforts with MOS-AK, a well-known industry compact modeling volunteer group primarily focused in Europe, to re-activate its Modeling Working Group. Its purpose, initiatives and deliverables coincide with MOS-AK's purpose, initiatives and deliverables. The Modeling Working Group plays a central role in developing a common language among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact model standardization and related tools for model development, validation/implementation and distribution.

    About
    MunEDA:
    MunEDA provides leading EDA software technology for analysis, modelling, optimization, and verification of performance and yield of analog, mixed-signal and digital designs. Founded in 2001 MunEDA has its headquarters in Munich, Germany, with worldwide offices and representations by leading EDA distributors worldwide. MunEDA solutions are in industrial use by leading semiconductor companies in the areas of communication, computer, memories, automotive, and consumer electronics.

    About
    Tanner EDA:
    Tanner EDA provides a complete line of software solutions that drive innovation for the design, layout and verification of analog and mixed-signal (A/MS) integrated circuits (ICs) and MEMS. Customers are creating breakthrough applications in areas such as power management, displays and imaging, automotive, consumer electronics, life sciences, and RF devices. Capability and performance are matched by low support requirements and high support capability as well as an ecosystem of partners that bring advanced capabilities to A/MS designs.