Web event: Enabling 3D-IC Integration
Date: July 18, 2012
Time:10:00 AM PDT
Duration: 45 minutes + Q&A
In this webinar, a guest speaker from Xilinx will introduce the challenges of designing for large capacity and performance and how Xilinx is innovating using Stacked Silicon Interconnect technology to deliver higher levels of integration and flexibility in their FPGA products
Senior Director, 3D-IC Strategy and Marketing, Synopsys
Steve Smith is currently responsible for Synopsys’ 3D-IC strategy and marketing. He has been with Synopsys for 15 years, having served in various functional verification and design implementation marketing roles. He has worked in the EDA and computer industries for more than 30 years in a variety of senior positions including marketing, applications engineering and software development.
Director of IC Design, Full-Chip FPGA Integration Group, Xilinx
Shankar Lakka is the Director of IC Design in the Full-chip FPGA Integration Group at Xilinx. He has been at Xilinx for more than 16 years, and has held various positions in the CPLD and FPGA divisions and led multiple projects across multiple sites. Shankar recently led the design and full-chip integration of Xilinx SSI devices. He holds 14 U.S. patents.