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    by Published on 10-30-2014 02:00 PM
    1. Categories:
    2. Semiconductor Design,
    3. Mentor,
    4. Mentor Emulation
    content/attachments/12380-veloce-abv-flow.jpg

    Chip deadlines and the time to achieve sufficient verification coverage run continuously in a tight loop like a dog chasing its tail. Naturally it is exciting when innovative technologies can be combined so that verification can gain an advantage. ...
    by Published on 10-30-2014 10:00 AM
    1. Categories:
    2. General,
    3. Events
    content/attachments/12382-lin0.jpg

    Last week was the Linley Microprocessor Conference. Not the mobile one, which I find the most interesting since smartphones are such a bit part of what drives process technology these days, this is the one focused on networking and servers. But increasingly both markets are being ...
    by Published on 10-30-2014 05:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Apache Design Inc.
    content/attachments/12386-redhawk.jpg

    I think by now there has been good level of discussion on FinFET technology at sub-20 nm process nodes and this is an answer to ultra dense, high performance, low power, and billion+ gate SoC designs within the same area. However, it comes with some of the key challenges with respect to power, noise and reliability of the design. A FinFET typically ...
    by Published on 10-29-2014 02:00 PM
    1. Categories:
    2. Semiconductor IP,
    3. Semiconductor Manufacturers,
    4. ARM,
    5. Atmel
    content/attachments/12373-da-vinci-2.1-aio.jpg

    The world is changing and IC companies need to adapt to this to stay competitive — moving to systems (hardware and software) vs. just product (hardware). Three key trends that are underway that change the way IC vendors need to think about their customer ...
    by Published on 10-29-2014 05:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Cadence
    content/attachments/12368-img_msbook.jpg

    Yesterday was Cadence's annual mixed-signal technology forum. I think that there was a definite theme running through many of the presentations, namely that wireless communication of one kind or another is on a sharp rise with more and more devices needing to connect ...
    by Published on 10-29-2014 02:58 AM
    content/attachments/12375-usb3.1-market-adoption.jpg

    USB is certainly the most ubiquitous of the Interface protocols. I would bet that everybody is using USB everyday (I mean activate a USB connection, as we also use PCIe or SATA even if we don’t realize that we do it), but which application will get benefit of the 10 Gbps delivered by USB 3.1? Before ...
    by Published on 10-29-2014 12:00 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. GlobalFoundries
    content/attachments/12372-ibm-2.jpg

    IBM last week agreed to transfer its semiconductor business to GlobalFoundries. GlobalFoundries will acquire wafer fabs in East Fishkill, New York and Essex Junction, Vermont; ...
    by Published on 10-28-2014 08:00 PM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. GlobalFoundries
    content/attachments/12369-gf-ibm-deal.jpg

    I have it on pretty good authority that IBM has in fact come to terms with GlobalFoundries on the sale of their semiconductor business, or so I blogged last month. Did I mention that my grandparents and their many siblings settled ...
    by Published on 10-28-2014 01:00 PM
    1. Categories:
    2. Semiconductor IP,
    3. CEVA
    content/attachments/12356-sckipio-16-port-g.fast-dpu.jpg

    After a four year gestation period typical of global communications standards, G.fast has reached the point where chipset makers can implement parts against stable specifications. Formal approval of the physical layer spec, G.9701, is expected by the end of 2014. G.9700, dealing ...
    by Published on 10-26-2014 05:00 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. TSMC
    content/attachments/12317-hou4_fotor.jpg

    I attended Cliff Hou's keynote at TSMC OIP Forum earlier this month. OIP is a huge undertaking. It currently has over 100 ecosystem partners, 10 technology generations, 7600+ IPs, 60+ EDA tools, 7000+ tech files and 150+ PDKs.

    Most of Cliff's presentation gave details ...

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