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    by Published on 09-22-2014 03:30 PM
    1. Categories:
    2. Semiconductor Design,
    3. Cadence
    content/attachments/12082-finfet-pcell.jpg

    The first consumer products with 20nm processing are arriving in 2014 like the 2 billion transistor A8 chip in the iPhone 6, however at the 14nm node there are new designs underway to continue the trend of Moore's Law. To get a better feel for the challenges of designing with 14nm ...
    by Published on 09-22-2014 11:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Calypto
    content/attachments/12077-sanjiv-narayan-2.jpg

    When we get the notion of expansion of a company, it always provides a positive picture about something good happening to boost that expansion. There can be several reasons for expansion such as merger & acquisition, formation of joint venture or partnership, large customer orders ...
    by Published on 09-21-2014 10:00 PM
    1. Categories:
    2. Semiconductor Design
    content/attachments/12073-signoff-corner-numbers.jpg

    Semiconductor companies continue to use the traditional corner-based signoff approach that has been developed more than 40+ years ago and has since remained mainly unchanged as an industry paradigm. Initially it had 2 corners, namely ...
    by Published on 09-21-2014 08:00 AM
    1. Categories:
    2. FPGA,
    3. Xilinx

    Even though Xilinx FPGAs seem to keep growing in densities and gobbling up boards into a single part, there is still the need for chip to chip connectivity and of course backplane connectivity. Xilinx 20nm UltraScale, ...
    by Published on 09-21-2014 05:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Silvaco
    content/attachments/12076-silv2_fotor.jpg

    Power devices have historically been made from silicon (Si), which has reached the limit of electric power loss reduction. With the superior physical and electrical properties of silicon carbide (SiC), we can expect to see a significant expansion ...
    by Published on 09-20-2014 11:00 AM  Number of Views: 3115 
    1. Categories:
    2. Semiconductor Manufacturers,
    3. Intel,
    4. TSMC
    content/attachments/12067-tsmc-intel-density-comparison.jpg

    The previous blog I did on the density difference between Intel 14nm and TSMC 20nm caused quite a stir and many interesting comments which I would like to address. After writing thousands of blogs on a wide variety of topics I have found ...
    by Published on 09-19-2014 03:00 PM
    1. Categories:
    2. Semiconductor IP,
    3. CEVA
    content/attachments/12062-yellow-flag.jpg

    The official term is “beneficiary rule”, but among colorful racing broadcasters, drivers, and fans it is more commonly referred to as the “lucky dog”: the driver who is down a lap, but gets to advance to the lead lap by virtue of being farthest ahead when a caution flag is raised.

    Qualcomm has lapped the entire field when it comes to cellular baseband chipsets, holding 66% market share according to the latest figures from Strategy Analytics. ...
    by Published on 09-19-2014 11:59 AM
    1. Categories:
    2. Semiconductor Design,
    3. Coventor
    content/attachments/12063-cov2.jpg

    One of the things about MEMS devices is that they almost always live on a chip that also contains the electronics necessary to process the output from the sensor. For example, an on-chip accelerometer for a car airbag deployment will contain the electronics ...
    by Published on 09-19-2014 05:00 AM
    1. Categories:
    2. General
    content/attachments/12061-americas-cup-oracle.jpg

    Larry Ellison resigning as CEO of Oracle caught me by surprise. I definitely did not see that one coming. Talk about the end of an era, as a 30+ year Silicon Valley veteran there have been quite a few industry icons ...
    by Published on 09-18-2014 10:05 AM
    content/attachments/12058-c-d-m-phy.gif

    The set of MIPI PHY specifications has enlarged during last night, as the MIPI Alliance has introduced the new C-PHY spec on September 17th, a physical layer interface for camera and display applications. "The MIPI C-PHY specification was developed to ...

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