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    by Published on 01-18-2017 11:00 AM
    1. Categories:
    2. Semiconductor Services,
    3. Semiconductor Intelligence,
    4. Semiconductor Events
    Tektronix Wiki-ee-pie-jpg

    CES 2017 wrapped up last week in Las Vegas. The show had over 175,000 attendees and over 3,800 exhibiting companies, according to the organizer, the Consumer Technology Association (CTA). The U.S. had the most companies exhibiting at CES with ...
    by Published on 01-18-2017 06:00 AM
    1. Categories:
    2. General
    Article: Model Driven Development-tech-jobs-min-jpeg

    There’s an article published in InfoWorld on jobs trends in several emerging tech areas. The trends are based on analysis of job postings and job-seeker searches from the beginning of 2014, sourced by Indeed.com. I would have ...
    by Published on 01-17-2017 11:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. FPGA,
    4. Flex Logix
    Article: A Brief History of Aldec-eflx_controller_example-jpg

    The start of the new year is typically a time for annual predictions. Prognostications are especially difficult in our industry, due to the increasing difficulty in Moore's Law technology scaling and greater design complexity challenges. There is one sure prediction, however -- this year will see the emergence of embedded FPGA (eFPGA) IP integration into a diverse set of SoC products.

    I recently had the opportunity to chat with Geoff ...
    by Published on 01-17-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Mentor Graphics,
    4. Semiconductor Events
    Article: A Brief History of Aldec-designcon-2017-jpg

    It's hard to believe but this is DesignCon #22 and being a Silicon Valley conference I have attended my fair share of them. This year it seems like high speed communications will take the lead followed by the latest on PCB design tools, power and signal integrity, jitter and crosstalk, test and measurement tools, parallel and memory interface design, ...
    by Published on 01-16-2017 11:00 AM
    1. Categories:
    2. Intel,
    3. IoT Internet of Things
    Article: 4 Billion CEVA powered Chips shipped (to be noticed: chips, not cores)-compute-card-devices-min-jpg

    Intel is once again adding a new computing form factor to the mix. At CES Intel announced its new Intel Compute Card. It combines CPU, GPU, DRAM, storage, WiFi, and communications inside a small modular housing slightly larger than a credit card and about 5mm thick. Intel already offers its Compute ...
    by Published on 01-16-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. FPGA,
    4. S2C
    Article: 2nd International RRAM Workshop at Stanford-s2c-fpga-prototyping-jpg

    I haven’t sat down to speak with S2C since we collaborated on the book, PROTOTYPICAL, published just before DAC 2016 and even then, I hadn’t spoken to Toshio Nakama, their CEO. Toshio splits his time between the San Jose headquarters and the Shanghai headquarters so getting time to meet ...
    by Published on 01-15-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. FD-SOI,
    4. FinFET
    Article: Tensilica Ships 2 Billionth Core-mos-ak-jpg

    The world-renowned statistician, Professor George Box, said, "Essentially, all models are wrong, but some are useful." -- that quote was the theme for one of the technical talks at the recent MOS-AK Workshop, held at UC-Berkeley.


    ...
    by Published on 01-13-2017 11:00 AM
    1. Categories:
    2. Semiconductor Manufacturers,
    3. TSMC
    Article: CDNLive Call For Papers-morris-chang-tsmc-jpg

    First, the TSMC Museum of Innovation is now open and it’s quite impressive. Located right below Fab 12, it is definitely worth an hour of your time. Second, Morris Chang was on the investor call which made it much more interesting, especially his comments on the recent ...
    by Published on 01-13-2017 06:00 AM
    1. Categories:
    2. Semiconductor Design,
    3. Cadence,
    4. Mobile,
    5. IoT Internet of Things
    Article: 4 Billion CEVA powered Chips shipped (to be noticed: chips, not cores)-home-automation-min-jpg

    Bluetooth has been very successful for many years, but arguably trapped in a niche, at least for us consumers, as a short-range wireless alternative to a wire connection – to connect your phone to a car or speakers for example. (In fairness I should add that the 4.2 version has improved ...
    by Published on 01-12-2017 11:00 AM
    1. Categories:
    2. Semiconductor IP,
    3. ARM,
    4. TSMC,
    5. FinFET
    EDACafe Mistakes Cadence Inc for Cadence Design Systems-finfet-cross-section-jpg

    If you click FinFET in the SemiWiki.com Latest News: navigation bar at the top of this page you will get a list of 86 blogs that have been viewed more than 600,000 times. If you go to the last blogs on the list, meaning the first blogs to be published, you will see a three part series, “Introduction to FinFET Technology” written by Tom Dillinger ...

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